IP Library Granted Patent US 7,312,995
Granted Patent B2
US 7,312,995 · App. 11/266,812 · Granted Dec 25, 2007

Cooling system for computer electronics

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Quick Facts
Patent No.
US 7,312,995
App. No.
11/266,812
Granted
Dec 25, 2007
Kind
B2
Abstract

A cooling system is provided for supplying a coolant flow to a cold plate associated with a processing chip of an electronic device to cool the processing chip. The system includes an electric motor driven fan; a radiator; an accumulator tank connected to the radiator for the transfer of coolant between the accumulator and the radiator; an electric driven pump connected to at least one of the radiator, the accumulator, and the cold plate to provide the coolant flow through the radiator and the cold plate; and a fan shroud adapted to direct the airflow provided by the fan. The fan, the radiator, the accumulator tank, and the pump are mounted on the shroud to be carried thereby, and the pump is located on an exterior side of the of the fan shroud and outside of the radiator and the accumulator tank.

Claims (25)

1. A cooling system for supplying a coolant flow to at least one cold plate associated with a processing chip of an electronic device to cool the processing chip, the system comprising:

an electric motor driven fan;

an air-cooled radiator to transfer heat from a coolant flow to an air flow provided by the fan;

an accumulator tank connected to the radiator for the transfer of the coolant between the accumulator and the radiator;

an electric driven pump connected to at least one of the radiator, the accumulator, and the at least one cold plate to provide the coolant flow through the radiator and the at least one cold plate; and

a fan shroud adapted to direct the airflow provided by the fan, wherein the fan, the radiator, the accumulator tank, and the pump are mounted on the shroud to be carried thereby, and the pump is located on an exterior side of the of the fan shroud and outside of the radiator and the accumulator tank.

2. The system of claim 1 wherein the fan shroud surrounds both the radiator and the fan.

3. The system of claim 1 further comprising a conduit connecting the pump to the radiator.

4. The system of claim 1 wherein the fan is part of a pancake type electric fan unit.

5. The system of claim 1 wherein the radiator includes flat tubes extending between the accumulator tank and a manifold to direct the coolant flow therebetween.

6. The system of claim 5 wherein the radiator further includes serpentine fins extending between adjacent tubes.

7. An electronic device comprising;

at least one processing chip; and

a cooling system for cooling the processing chip, the cooling system comprising

at least one cold plate mounted adjacent the at least one processing chip to transfer heat from the processing chip to a coolant flow passing through the at least one cold plate;

an electric motor driven fan;

an air-cooled radiator to transfer heat from the coolant flow to an air flow provided by the fan;

an accumulator tank connected to the radiator for the transfer of the coolant between the accumulator and the radiator;

an electric driven pump connected to at least one of the radiator, the accumulator, and the at least one cold plate to provide the coolant flow through the radiator and the at least one cold plate; and

a fan shroud adapted to direct the airflow provided by the fan, wherein the fan, the radiator, the accumulator tank, and the pump are mounted on the shroud, the shroud is mounted to the electronic device, and the pump is located on an exterior side of the of the fan shroud and outside of the radiator and the accumulator tank.

8. The electronic device of claim 7 wherein the fan shroud surrounds both the radiator and the fan.

9. The electronic device of claim 7 wherein the cooling system further comprises a conduit connecting the pump to the radiator.

10. The electronic device of claim 7 wherein the fan is part of a pancake type electric fan unit.

11. The electronic device of claim 7 wherein the radiator comprises flat tubes extending between the accumulator tank and a manifold to direct the coolant flow therebetween.

12. The electronic device of claim 11 wherein the radiator further comprises serpentine fins extending between adjacent tubes.

Assignments (11)
RELEASE (REEL047028/FRAME0743) Recorded Jul 30, 2024
From: ROYAL BANK OF CANADA
To: LTI FLEXIBLE PRODUCTS, INC.; LIFETIME INDUSTRIES, INC.; AAVID THERMALLOY, LLC (NOW KNOWN AS BOYD LACONIA, LLC; NUVENTIX, INC.; THERMAL CORP. (NOW KNOWN AS AAVID THERMAL CORP.; CSI MEDICAL, INC.
Reel/Frame 068195/0243 →
RELEASE OF FIRST LIEN SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (042477/0565) Recorded Sep 10, 2018
From: ANTARES CAPITAL LP, AS ADMINISTRATIVE AND COLLATERAL AGENT
To: LTI HOLDINGS, INC.; AAVID NIAGARA, LLC; AAVID THERMACORE, INC.; AAVID THERMAL CORP.; AAVID THERMALLOY, LLC,; LIFETIME INDUSTRIES, INC.; LTI FLEXIBLE PRODUCTS, INC.; NUVENTIX, INC.
Reel/Frame 047052/0001 →
RELEASE OF SECOND LIEN SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (042477/0643) Recorded Sep 10, 2018
From: ANTARES CAPITAL LP, AS ADMINISTRATIVE AND COLLATERAL AGENT
To: LTI HOLDINGS, INC.; AAVID NIAGARA, LLC; AAVID THERMACORE, INC.; AAVID THERMAL CORP.; AAVID THERMALLOY, LLC; LIFETIME INDUSTRIES, INC.; LTI FLEXIBLE PRODUCTS, INC.; NUVENTIX, INC.
Reel/Frame 047223/0380 →
SECOND LIEN SECURITY INTEREST Recorded Sep 7, 2018
From: LTI FLEXIBLE PRODUCTS, INC.; LIFETIME INDUSTRIES, INC.; AAVID THERMALLOY, LLC; NUVENTIX, INC.; AAVID THERMAL CORP. (F/K/A THERMAL CORP.); CSI MEDICAL, INC.
To: ROYAL BANK OF CANADA
Reel/Frame 047028/0743 →
FIRST LIEN SECURITY INTEREST Recorded Sep 6, 2018
From: LTI FLEXIBLE PRODUCTS, INC.; LIFETIME INDUSTRIES, INC.; AAVID THERMALLOY, LLC; NUVENTIX, INC.; AAVID THERMAL CORP. (F/K/A THERMAL CORP.); CSI MEDICAL, INC.
To: ROYAL BANK OF CANADA
Reel/Frame 047026/0666 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 40355/0672 Recorded May 23, 2017
From: ANTARES CAPITAL LP, AS SUCCESSOR TO GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: THERMAL CORP.
Reel/Frame 042554/0151 →
FIRST LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded May 16, 2017
From: LTI HOLDINGS, INC.; AAVID NIAGARA, LLC; AAVID THERMACORE, INC.; AAVID THERMAL CORP.; AAVID THERMALLOY, LLC; LIFETIME INDUSTRIES, INC.; LTI FLEXIBLE PRODUCTS, INC.; NUVENTIX, INC.
To: ANTARES CAPITAL LP, AS AGENT
Reel/Frame 042477/0565 →
SECOND LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded May 16, 2017
From: LTI HOLDINGS, INC.; AAVID NIAGARA, LLC; AAVID THERMACORE, INC.; AAVID THERMAL CORP.; AAVID THERMALLOY, LLC; LIFETIME INDUSTRIES, INC.; LTI FLEXIBLE PRODUCTS, INC.; NUVENTIX, INC.
To: ANTARES CAPITAL LP, AS AGENT
Reel/Frame 042477/0643 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 035134/0363 Recorded Oct 20, 2016
From: PINE STREET CAPITAL PARTNERS II, L.P.
To: THERMAL CORP.
Reel/Frame 040425/0584 →
SECURITY INTEREST Recorded Oct 14, 2016
From: THERMAL CORP.
To: ANTARES CAPITAL LP, AS AGENT
Reel/Frame 040355/0672 →
SECURITY INTEREST Recorded Mar 6, 2015
From: THERMAL CORP.
To: PINE STREET CAPITAL PARTNERS II, L.P.
Reel/Frame 035134/0363 →