Patent Assignment
Reel/Frame 040355/0672
Security Interest
Recorded: 2016-10-14
Pages: 11
Assignor
THERMAL CORP.
Executed: 2016-10-13
Assignee
ANTARES CAPITAL LP, AS AGENT
500 WEST MONROE STREET, CHICAGO, ILLINOIS, 60661
Covered Properties
(73)
Heat Pipes for Transferring Heat Between Hinged Devices
Patent:
5,822,187 →
Application:
08/735,191 →
Heat Pipe Cooling for Turbine Stators
Patent:
5,975,841 →
Application:
08/943,626 →
Integrated Circuit Heat Pipe Heat Spreader with Through Mounting Holes
Patent:
6,302,192 →
Application:
09/310,397 →
Fluid Cooled Single Phase Heat Sink
Patent:
6,131,650 →
Application:
09/357,226 →
Heat Spreader with Excess Solder Basin
Patent:
6,191,946 →
Application:
09/476,813 →
Flexible Heat Pipe
Patent:
6,446,706 →
Application:
09/625,301 →
Liquid Cooled Heat Exchanger with Enhanced Flow
Patent:
6,578,626 →
Application:
09/717,860 →
Semiconductor Package with Internal Heat Spreader
Patent:
6,437,437 →
Application:
09/753,893 →
Semiconductor Package with Lid Heat Spreader
Capacitor with Heat Pipe Cooling
Integrated Circuit Heat Pipe Heat Spreader with Through Mounting Holes
Porous Vapor Valve for Improved Loop Thermosiphon Performance
Thermal Bus for Cabinets Housing High Power Electronics Equipment
Integrated Thermal Architecture for Thermal Management of High Power Electronics
Patent:
6,388,882 →
Application:
09/909,360 →
Modular Cooling System and Thermal Bus for High Power Electronics Cabinets
Heat Spreader with Oscillating Flow
Electronics Package with Specific Areas Having Low Coefficient of Thermal Expansion
Patent:
6,566,743 →
Application:
10/081,470 →
Thermal Management System and Method for Electronics System
Liquid Cooled Heat Exchanger with Enhanced Flow
Method of Making Electronics Package with Specific Areas Having Low Coefficient of Thermal Expansion
Patent:
6,579,747 →
Application:
10/219,731 →
Semiconductor Package with Lid Heat Spreader
Cooling System for Hinged Portable Computing Device
Heat Pipe for Cautery Surgical Instrument
Patent:
6,905,499 →
Application:
10/305,608 →
Heat Pipe for Cautery Surgical Instrument
Patent:
6,800,077 →
Application:
10/305,609 →
Heat Dissipation Unit with Direct Contact Heat Pipe
Patent:
6,717,813 →
Application:
10/413,601 →
Sintered Grooved Wick with Particle Web
Heat Pipe Fin Stack with Extruded Base
Patent:
6,830,098 →
Application:
10/457,309 →
Cte-Matched Heat Pipe
Patent:
6,793,009 →
Application:
10/458,168 →
Brazed Wick for a Heat Transfer Device
Thermal Bus for Electronics Systems
Chemically Compatible, Lightweight Heat Pipe
Thermal Management System and Method for Electronics System
Fluid Circuit Heat Transfer Device for Plural Heat Sources
Integrated Circuit Heat Pipe Heat Spreader with Through Mounting Holes
Forced Fluid Heat Sink
Heat Pipe Component Deployed from a Compact Volume
Capillary Assisted Loop Thermosiphon Apparatus
Integrated Circuit Heat Pipe Heat Spreader with Through Mounting Holes
Cte-Matched Heat Pipe
Heat Pipe Evaporator with Porous Valve
Heat Pipe for Cautery Surgical Instrument
Porous Media Cold Plate
Hybrid Loop Heat Pipe
Semiconductor Package with Lid Heat Spreader
Integrated Circuit Heat Pipe Heat Spreader with Through Mounting Holes
Modular Heat Sink
Cooling Element for Electrosurgery
Integrated Circuit Heat Pipe Heat Spreader with Through Mounting Holes
Flexible Loop Thermosyphon
Thermal Management System and Method for Electronics System
Liquid Cooled Heat Sink with Cold Plate Retention Mechanism
Heat Pipe with Axial and Lateral Flexibility
Cooling System for Computer Electronics
Chemically Compatible, Lightweight Heat Pipe
Porous Media Cold Plate
Fluid Circuit Heat Transfer Device for Plural Heat Sources
Heat Pipe with Axial and Lateral Flexibility
Porous Media Cold Plate
Chemically Compatible, Lightweight Heat Pipe
Capillary Assisted Loop Thermosiphon Apparatus
Cte-Matched Heat Pipe
Application:
13/074,987 →
Publication:
US 2011/0176276
Variable-Conductance Heat Transfer Device
Heat Pipe Having a Wick with a Hybrid Profile
Heat Exchange Apparatus
Application:
13/702,659 →
Publication:
US 2013/0081788
Electronics Cabinet and Rack Cooling System and Method
Heat Exchanger Backing Plate and Method of Assembling Same
Cooling Frame with Integrated Heat Pipes
Application:
13/789,751 →
Publication:
US 2014/0251577
Heat Transfer Apparatus and Method
Reinforced Heat-Transfer Device, Heat-Transfer System, and Method of Reinforcing a Heat-Transfer Device
Capillary Device for Use in Heat Pipe and Method of Manufacturing Such Capillary Device
Application:
14/119,814 →
Publication:
US 2014/0190667
Vehicle Thermal Management System
Electronics Rack with Selective Engagement of Heat Sink
Application:
62/299,318 →
Electronics Rack with Compliant Heat Pipe
Application:
62/299,336 →
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest Recorded at Reel/Frame 035134/0363
Oct 20, 2016
From: PINE STREET CAPITAL PARTNERS II, L.P.
To: THERMAL CORP.
Reel/Frame 040425/0584 →
Release of Security Interest Recorded at Reel/Frame 021398/0300
Oct 28, 2016
From: NATIONAL PENN BANK
To: THERMAL CORP.; THERMACORE, INC. F/K/A FSBO VENTURE ACQUISITIONS, INC.
Reel/Frame 040508/0620 →
Release of Security Interest Recorded at Reel/Frame 026039/0865
Oct 28, 2016
From: SANTANDER BANK, N.A. F/K/A SOVEREIGN BANK
To: THERMAL CORP.; THERMACORE, INC.
Reel/Frame 040508/0649 →
Assignment of Assignor's Interest
Mar 3, 2017
From: THERMAL CORP.
To: AAVID THERMALLOY, LLC
Reel/Frame 041455/0769 →
First Lien Security Interest
Sep 6, 2018
From: LTI FLEXIBLE PRODUCTS, INC.; LIFETIME INDUSTRIES, INC.; AAVID THERMALLOY, LLC; NUVENTIX, INC.
To: ROYAL BANK OF CANADA
Reel/Frame 047026/0666 →
Second Lien Security Interest
Sep 7, 2018
From: LTI FLEXIBLE PRODUCTS, INC.; LIFETIME INDUSTRIES, INC.; AAVID THERMALLOY, LLC; NUVENTIX, INC.
To: ROYAL BANK OF CANADA
Reel/Frame 047028/0743 →
Release of Second Lien Security Interest in Patents Previously Recorded at Reel/Frame (042477/0643)
Sep 10, 2018
From: ANTARES CAPITAL LP, AS ADMINISTRATIVE AND COLLATERAL AGENT
To: LTI HOLDINGS, INC.; AAVID NIAGARA, LLC; AAVID THERMACORE, INC.; AAVID THERMAL CORP.
Reel/Frame 047223/0380 →
Release of First Lien Security Interest in Patents Previously Recorded at Reel/Frame (042477/0565)
Sep 10, 2018
From: ANTARES CAPITAL LP, AS ADMINISTRATIVE AND COLLATERAL AGENT
To: LTI HOLDINGS, INC.; AAVID NIAGARA, LLC; AAVID THERMACORE, INC.; AAVID THERMAL CORP.
Reel/Frame 047052/0001 →
Release (REEL047028/FRAME0743)
Jul 30, 2024
From: ROYAL BANK OF CANADA
To: LTI FLEXIBLE PRODUCTS, INC.; LIFETIME INDUSTRIES, INC.; AAVID THERMALLOY, LLC (NOW KNOWN AS BOYD LACONIA, LLC; NUVENTIX, INC.
Reel/Frame 068195/0243 →