Integrated circuit heat pipe heat spreader with through mounting holes
View Patent ↗The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.
1. A heat pipe for spreading heat comprising:
a boundary structure including a first plate and a second plate arranged in spaced apart relation, each of said plates including interior confronting surfaces and a peripheral lip located at an edge of said boundary structure which are bonded together so as to define an enclosed vapor chamber;
a depression formed in said first plate which projects into said vapor chamber, is spaced from said peripheral lip, and is bonded to said second plate;
an opening defined through said first plate depression and said second plate wherein said depression comprises an annular outer surface that is bonded to a corresponding annular edge surface in said second plate and further wherein said opening is isolated from said vapor chamber;
at least one spacer extending between and contacting said first and second plates; and
a wick positioned upon said confronting interior surfaces including that portion of the interior surface of said first plate that forms a surface of said depression within said vapor chamber.
2. A heat pipe for spreading heat comprising:
a first plate having a circumferential edge lip bounding an inner surface and at least one hollow column that is integral with said first plate and which projects outwardly relative to said inner surface;
a second plate arranged in spaced apart confronting relation to said first plate and including a circumferential edge lip bounding an inner surface and at least one opening through said second plate, said edge lips of said first and second plates being bonded together so as to define a vapor chamber; wherein
a hollow column bonded at one end to said second plate so as to coaxially align said hollow column with one of said at least one openings in said second plate thereby to form a mounting hole that extends through said first plate and said second plate and is isolated from said vapor chamber.
3. A heat pipe for spreading heat comprising:
a first plate having a circumferential edge lip bounding an inner surface and a depression which projects outwardly relative to said inner surface;
a second plate arranged in spaced apart confronting relation to said first plate and including a circumferential edge lip bounding an inner surface and at least one opening through said second plate, said edge lips of said first and second plates being bonded together so as to define a vapor chamber; wherein
said depression having an open ended tubular cross-section and an outer surface, a portion of which outer surface is bonded to said second plate so as to coaxially align said depression with one of said at least one openings in said second plate thereby to form a mounting hole that extends through said first plate depression and said second plate and is isolated from said vapor chamber.
4. A heat pipe for spreading heat comprising:
a first plate having a circumferential edge lip bounding an inner surface and a hollow column which projects outwardly relative to said inner surface;
a second plate arranged in spaced apart confronting relation to said first plate and including (i) a circumferential edge lip bounding an inner surface, (ii) at least one depression which projects into said vapor chamber and that is bonded to said inner surface of said first plate, and (iii) at least one opening through said second plate, said edge lips of said first and second plates being bonded together so as to define a vapor chamber; wherein
said hollow column in said first plate opens at a first end and a second end and is bonded to said second plate at said second end so as to coaxially align said hollow column with said at least one opening in said second plate thereby to form a mounting hole that extends through said first plate depression and said second plate and is isolated from said vapor chamber.
5. An integrated circuit chip cooling structure comprising:
a top plate having an edge lip that bounds a top surface and a bottom surface;
a bottom plate having an edge lip that bounds a top surface and a bottom surface, said edge lips of said top and bottom plates being bonded together so as to define a vapor chamber;
a capillary wick provided within said vapor chamber;
wherein said top plate and said bottom plate each define at least one opening such that the at least one opening of said top plate and the at least one opening of said bottom plate are vertically aligned;
at least one hollow column extending between said top plate and said bottom plate, said at least one hollow column having a top end sealed to a periphery of said opening defined in said top plate and a bottom end sealed to a periphery of said opening defined in said bottom plate, said at least one hollow column having a central passageway sized to receive a fastener.
6. The integrated circuit chip cooling structure according to claim 5 comprising at least one heat sink, said at least one heat sink having a bottom surface attached to the top surface of said top plate and at least one mounting hole communicating with said at least one hollow column; and
a fastener extending through said hollow column and through said mounting hole of said at least one heat sink to secure said heat sink to said top and bottom plates.
7. The integrated circuit chip cooling structure according to claim 6 wherein said at least one heat sink comprises a base and a plurality of fins located on one side of said base.
8. The integrated circuit chip cooling structure according to claim 5 wherein each of said at least one hollow column each has a top shoulder disposed near a top end and bonded to a bottom surface of said top plate around one opening.
9. The integrated circuit chip cooling structure according to claim 8 wherein each of said at least one hollow column each has a bottom end downwardly extending out of said bottom plate through one opening defined in said bottom plate.
10. The integrated circuit chip cooling structure according to claim 5 wherein said at least one hollow column has a top shoulder disposed near a top end and bonded to a bottom surface of said top plate around one opening defined in said top plate and a bottom shoulder disposed near a bottom end and bonded to a top surface of said bottom plate around one opening defined in said bottom plate.
11. The integrated circuit chip cooling structure according to claim 5 wherein said capillary wick comprises an upper planar wick located on a bottom surface of said top plate, a bottom planar wick located on a top surface of said bottom plate, and a plurality of vertical wick elements provided between said upper planar wick and said bottom planar wick, said vertical wicks each having a first end integral with one of said top and bottom plate and a second end supported on the other of said top and bottom plates; said at least one hollow column being inserted through said top planar wick and said bottom planar wick.