Patent Assignment
Reel/Frame 040508/0620
Release of Security Interest Recorded at Reel/Frame 021398/0300
Recorded: 2016-10-28
Pages: 8
Assignor
NATIONAL PENN BANK
Executed: 2010-12-30
Assignees
THERMAL CORP.
1 AAVID CIR, LACONIA, NEW HAMPSHIRE, 03246
THERMACORE, INC. F/K/A FSBO VENTURE ACQUISITIONS, INC.
780 EDEN ROAD, LANCASTER, PENNSYLVANIA, 17601
Covered Properties
(109)
Integrated Circuit Cooling Apparatus
Patent:
5,549,155 →
Application:
08/424,791 →
Electrically Insulated Envelope Heat Pipe
Patent:
5,642,776 →
Application:
08/607,897 →
Heat Pipes for Transferring Heat Between Hinged Devices
Patent:
5,822,187 →
Application:
08/735,191 →
Integrated Circuit Heat Sink with Rotatable Heat Pipe
Patent:
5,826,645 →
Application:
08/844,811 →
Heat Pipe Cooling for Turbine Stators
Patent:
5,975,841 →
Application:
08/943,626 →
Method of Installing Heat Pipes Using Internal Vapor Pressure
Patent:
6,065,664 →
Application:
09/131,528 →
Integrated Circuit Heat Pipe Heat Spreader with Through Mounting Holes
Patent:
6,302,192 →
Application:
09/310,397 →
Fluid Cooled Single Phase Heat Sink
Patent:
6,131,650 →
Application:
09/357,226 →
Stress Relieved Integrated Circuit Cooler
Patent:
6,169,660 →
Application:
09/431,368 →
Heat Spreader with Excess Solder Basin
Patent:
6,191,946 →
Application:
09/476,813 →
Flexible Heat Pipe
Patent:
6,446,706 →
Application:
09/625,301 →
Heat Sink Assembly with Over Molded Cooling Fins
Patent:
6,408,935 →
Application:
09/639,165 →
Thermal jacket for reducing condensation and method for making same
Patent:
6,367,544 →
Application:
09/717,409 →
Liquid Cooled Heat Exchanger with Enhanced Flow
Patent:
6,578,626 →
Application:
09/717,860 →
Liquid-cooled heat sink with thermal jacket
Patent:
6,367,543 →
Application:
09/734,092 →
Semiconductor Package with Internal Heat Spreader
Patent:
6,437,437 →
Application:
09/753,893 →
Semiconductor Package with Lid Heat Spreader
Capacitor with Heat Pipe Cooling
Portable Computer and Docking Station Cooling
Integrated Circuit Heat Pipe Heat Spreader with Through Mounting Holes
Heat management system
Patent:
6,351,381 →
Application:
09/885,470 →
Porous Vapor Valve for Improved Loop Thermosiphon Performance
Folded Fin Plate Heat-Exchanger
Patent:
6,408,941 →
Application:
09/898,774 →
Thermal Bus for Cabinets Housing High Power Electronics Equipment
Integrated Thermal Architecture for Thermal Management of High Power Electronics
Patent:
6,388,882 →
Application:
09/909,360 →
Compact Fluid to Fluid Heat Exchanger
Patent:
6,405,792 →
Application:
09/911,762 →
Non-Inverted Meniscus Loop Heat Pipe/Capillary Pumped Loop Evaporator
Heat Pipe System for Cooling Flywheel Energy Storage Systems
Liquid-Cooled Heat Sink with Thermal Jacket
Bi-Level Heat Sink
Patent:
6,626,233 →
Application:
10/038,636 →
Heat Spreader with Oscillating Flow
Electronics Package with Specific Areas Having Low Coefficient of Thermal Expansion
Patent:
6,566,743 →
Application:
10/081,470 →
Fin with Elongated Hole and Heat Pipe with Elongated Cross Section
Serpentine, Slit Fin Heat Sink Device
Patent:
6,590,770 →
Application:
10/098,000 →
Flat Plate Fuel Cell Cooler
Multiple Temperature Sensitive Devices Using Two Heat Pipes
Thermal Management System and Method for Electronics System
Liquid Cooled Heat Exchanger with Enhanced Flow
Method of Making Electronics Package with Specific Areas Having Low Coefficient of Thermal Expansion
Patent:
6,579,747 →
Application:
10/219,731 →
Semiconductor Package with Lid Heat Spreader
Combination Tower and Serpentine Fin Heat Sink Device
Cooling System for Hinged Portable Computing Device
Bi-Level Heat Sink
Cylindrical Fin Tower Heat Sink and Heat Exchanger
Patent:
6,712,128 →
Application:
10/300,094 →
Heat Pipe for Cautery Surgical Instrument
Patent:
6,905,499 →
Application:
10/305,608 →
Heat Pipe for Cautery Surgical Instrument
Patent:
6,800,077 →
Application:
10/305,609 →
Cooler for Power Electronics
Deformable End Cap for Heat Pipe
Heat Pipe Having a Wick Structure Containing Phase Change Materials
Heat Exchanger for Electronic/Electrical Components
Sintered Grooved Wick with Particle Web
Heat Pipe Fin Stack with Extruded Base
Patent:
6,830,098 →
Application:
10/457,309 →
Cte-Matched Heat Pipe
Patent:
6,793,009 →
Application:
10/458,168 →
Vapor Chamber with Sintered Grooved Wick
Brazed Wick for a Heat Transfer Device
Tower Heat Sink with Sintered Grooved Wick
Thermal Bus for Electronics Systems
Chemically Compatible, Lightweight Heat Pipe
Cooling System for Electronics with Improved Thermal Interface
Thermal Management System and Method for Electronics System
Fluid Circuit Heat Transfer Device for Plural Heat Sources
Hybrid Loop Heat Pipe
Multiple temperature sensitive devices using two heat pipes
Application:
10/696,270 →
Publication:
US 2004/0112583
Integrated Circuit Heat Pipe Heat Spreader with Through Mounting Holes
Heat Transfer Device and Method of Making Same
Flexible Loop Thermosyphon
Heat Pipe Component Deployed from a Compact Volume
Capillary Assisted Loop Thermosiphon Apparatus
Method for Forming a Heat Dissipation Device
Heat transfer device and method of making same
Application:
10/829,104 →
Publication:
US 2005/0022976
Integrated Circuit Heat Pipe Heat Spreader with Through Mounting Holes
Air-To-Air Heat Exchanger
Bonded Silicon, Components and a Method of Fabricating the Same
Cte-Matched Heat Pipe
Heat Pipe with Chilled Liquid Condenser System for Burn-in Testing
Heat Pipe Evaporator with Porous Valve
Heat Pipe for Cautery Surgical Instrument
Porous Media Cold Plate
Heat Pipe Fin Stack with Extruded Base
Deformable End Cap for Heat Pipe
Hybrid Loop Heat Pipe
Semiconductor Package with Lid Heat Spreader
Vapor Chamber with Sintered Grooved Wick
Brazed Wick for a Heat Transfer Device and Method of Making Same
CTE-matched heat pipe
Application:
11/065,465 →
Publication:
US 2005/0139995
Integrated Circuit Heat Pipe Heat Spreader with Through Mounting Holes
Daughterboard with Sense and Release System
Patent:
7,083,444 →
Application:
11/079,752 →
Brazed Wick for a Heat Transfer Device
Brazed wick for a heat transfer device
Application:
11/120,238 →
Publication:
US 2005/0205243
Integrated circuit heat pipe heat spreader with through mounting holes
Application:
11/128,453 →
Publication:
US 2005/0217826
Sintered Grooved Wick with Particle Web
Modular Heat Sink
Cooling Element for Electrosurgery
Integrated Circuit Heat Pipe Heat Spreader with Through Mounting Holes
Flexible Loop Thermosyphon
Thermal Management System and Method for Electronics System
Liquid Cooled Heat Sink with Cold Plate Retention Mechanism
Heat Pipe with Axial and Lateral Flexibility
Vapor compression cooling system for cooling electronics
Application:
11/264,406 →
Publication:
US 2007/0095087
Heat Pipe Evaporator with Porous Valve
Method of Forming a Heat Pipe
Heat transfer device and method of making same
Application:
11/344,857 →
Publication:
US 2006/0124281
Chemically Compatible, Lightweight Heat Pipe
Porous Media Cold Plate
Heat Pipe Component Deployed from a Compact Volume
Application:
11/421,235 →
Publication:
US 2006/0201654
Flexible Loop Thermosyphon
Application:
11/461,878 →
Publication:
US 2006/0254753
Heat pipe fin stack with extruded base
Application:
11/467,711 →
Publication:
US 2009/0126192
Brazed Wick for a Heat Transfer Device and Method of Making Same
Application:
11/561,658 →
Publication:
US 2007/0089865
Liquid Cooled Heat Sink with Cold Plate Retention Mechanism
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Oct 14, 2016
From: THERMAL CORP.
To: ANTARES CAPITAL LP, AS AGENT
Reel/Frame 040355/0672 →
Release of Security Interest Recorded at Reel/Frame 035134/0363
Oct 20, 2016
From: PINE STREET CAPITAL PARTNERS II, L.P.
To: THERMAL CORP.
Reel/Frame 040425/0584 →
Release of Security Interest Recorded at Reel/Frame 026039/0865
Oct 28, 2016
From: SANTANDER BANK, N.A. F/K/A SOVEREIGN BANK
To: THERMAL CORP.; THERMACORE, INC.
Reel/Frame 040508/0649 →
Assignment of Assignor's Interest
Mar 3, 2017
From: THERMAL CORP.
To: AAVID THERMALLOY, LLC
Reel/Frame 041455/0769 →
First Lien Security Interest
Sep 6, 2018
From: LTI FLEXIBLE PRODUCTS, INC.; LIFETIME INDUSTRIES, INC.; AAVID THERMALLOY, LLC; NUVENTIX, INC.
To: ROYAL BANK OF CANADA
Reel/Frame 047026/0666 →
Second Lien Security Interest
Sep 7, 2018
From: LTI FLEXIBLE PRODUCTS, INC.; LIFETIME INDUSTRIES, INC.; AAVID THERMALLOY, LLC; NUVENTIX, INC.
To: ROYAL BANK OF CANADA
Reel/Frame 047028/0743 →
Release of Second Lien Security Interest in Patents Previously Recorded at Reel/Frame (042477/0643)
Sep 10, 2018
From: ANTARES CAPITAL LP, AS ADMINISTRATIVE AND COLLATERAL AGENT
To: LTI HOLDINGS, INC.; AAVID NIAGARA, LLC; AAVID THERMACORE, INC.; AAVID THERMAL CORP.
Reel/Frame 047223/0380 →
Release of First Lien Security Interest in Patents Previously Recorded at Reel/Frame (042477/0565)
Sep 10, 2018
From: ANTARES CAPITAL LP, AS ADMINISTRATIVE AND COLLATERAL AGENT
To: LTI HOLDINGS, INC.; AAVID NIAGARA, LLC; AAVID THERMACORE, INC.; AAVID THERMAL CORP.
Reel/Frame 047052/0001 →
Release (REEL047028/FRAME0743)
Jul 30, 2024
From: ROYAL BANK OF CANADA
To: LTI FLEXIBLE PRODUCTS, INC.; LIFETIME INDUSTRIES, INC.; AAVID THERMALLOY, LLC (NOW KNOWN AS BOYD LACONIA, LLC; NUVENTIX, INC.
Reel/Frame 068195/0243 →