Cooling system for electronics with improved thermal interface
View Patent ↗A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.
1. A heat pipe system comprising:
a heat transfer block including at least two clip channels that are defined in spaced relation to one another through a central portion of said heat transfer block; and,
a heat pipe coupled to the heat transfer block by a flattened planar clip having (i) a central channel defined in a bottom surface that is sized to receive a portion of said heat pipe and (ii) spaced apart tabs that protect outwardly from said bottom surface of said flattened clip adjacent to sides of said central channel so that said spaced apart tabs are received in said at least two clip channels.
2. The heat pipe system of claim 1 , wherein the clip includes a main surface and two side surfaces disposed substantially orthogonal to the main surface.
3. The heat pipe system of claim 1 , wherein the heat transfer block includes at least one heat pipe channel disposed therein between said at least two clip channels for receiving the heat pipe.
4. The heat pipe system of claim 3 , wherein the heat pipe includes a main portion and a pinchoff portion, wherein the pinchoff portion is disposed in the heat pipe channel.
5. The heat pipe system of claim 3 , wherein the heat pipe is coupled to the heat pipe channel by solder.
6. The heat pipe system of claim 3 , wherein the heat pipe is coupled to the heat pipe channel by epoxy.
7. The heat pipe system of claim 3 , wherein the heat pipe is coupled to the heat pipe channel by friction.
8. The heat pipe system of claim 3 , wherein the heat pipe is coupled to the heat pipe channel by at least one fastener.
9. The heat pipe system of claim 2 , wherein the heat transfer block includes at least one clip channel disposed therein for receiving the clip, such that the two side surfaces of the clip are disposed in the at least one clip channel.
10. The heat pipe system of claim 9 , wherein the clip is coupled to the at least two clip channels by solder.
11. The heat pipe system of claim 9 , wherein the clip is coupled to the at least two clip channels by epoxy.
12. The heat pipe system of claim 9 , wherein the clip is coupled to the at least two clip channels by friction.
13. The heat pipe system of claim 9 , wherein the heat pipe is coupled to the heat pipe channel by at least one fastener.
14. The heat pipe system of claim 2 , wherein the heat transfer block includes at least two clip channels disposed therein for receiving the clip, such that the two side surfaces of the clip are disposed in the at least two clip channels.
15. The heat pipe system of claim 14 , wherein the clip is coupled to the at least two clip channels by solder.
16. The heat pipe system of claim 14 , wherein the clip is coupled to the at least two clip channels by epoxy.
17. The heat pipe system of claim 14 , wherein the clip is coupled to the at least two clip channels by friction.
18. The heat pipe system of claim 14 , wherein the heat pipe is coupled to the heat pipe channel by at least one fastener.
19. The heat pipe system of claim 1 , wherein the clip includes a top surface with at least two tabs extending orthogonally from said bottom surface and spaced apart by a distance that is less than a width of said heat pipe.
20. The heat pipe system of claim 19 , wherein the heat transfer block includes at least two channels for receiving the at least two tabs in the clip.
21. The heat pipe system of claim 1 , wherein the clip extends substantially across an entire top surface of the heat transfer block.
22. A computer comprising:
at least one electronic component;
a heat transfer block disposed adjacent to the at least one electronic component, said heat transfer block including a central channel and at least two clip channels that are defined in spaced relation to one another and each being adjacent to said central channel; and,
a heat pipe coupled to the heat transfer block by a flattened clip having spaced apart tabs that project outwardly from a side surface so as to be received in said at least two clip channels for coupling said heat transfer block to said heat pipe.
23. A heat pipe system comprising:
a heat transfer block including a central channel and at least two clip channels that are defined in spaced relation to one another and each being adjacent to said central channel; and
a heat pipe positioned within said central channel; and
a flattened clip having spaced apart tabs that project outwardly from a side surface so as to be received in said at least two clip channels for coupling said heat transfer block to said heat pipe.
24. A heat pipe system comprising:
a heat transfer block including a central channel and at least two substantially parallel clip channels that are defined in spaced relation to one another and each being adjacent to said central channel; and
a heat pipe having a flattened end positioned within said central channel; and
a flattened clip having spaced apart, substantially parallel tabs that project outwardly from a surface so as to be received in said at least two clip channels for coupling said heat transfer block to said flattened end of said heat pipe.
25. The heat pipe system of claim 24 wherein said flattened clip includes a bottom surface wherein said spaced apart tabs project orthogonally from said bottom surface.
26. The heat pipe system of claim 25 wherein said spaced apart tabs are coupled to said at least two clip channels by friction.
27. The heat pipe system of claim 24 wherein said flattened clip includes a main surface and two side surfaces disposed substantially orthogonal to said main surface and further wherein said heat transfer block includes at least two clip channels disposed therein for receiving a portion of said flattened clip such that said two side surfaces of said flattened clip are disposed in said at least two clip channels.
28. The heat pipe system of claim 24 wherein said flattened clip extends substantially across an entire top surface of said heat transfer block.
29. A heat pipe system comprising:
a heat transfer block including at least two clip channels that are defined in spaced relation to one another; and,
a heat pipe coupled to the heat transfer block by a flattened clip comprising (i) a central channel that is sized to receive a portion of said heat pipe and having a first side and a second side, and (ii) a first tab that projects outwardly from said first side and a second tab that projects outwardly from said second side so as to be received, respectively, in said at least two clip channels thereby coupling said heat transfer block to said heat pipe.
30. The heat pipe system of claim 29 wherein said flattened clip includes a bottom surface wherein said spaced apart tabs project orthogonally from said bottom surface and said central channel is defined in said bottom surface.
31. The heat pipe system of claim 29 wherein said spaced apart tabs are coupled to said at least two clip channels by friction.
32. The heat pipe system of claim 29 wherein said flattened clip includes a flattened main surface and two side surfaces disposed substantially orthogonal to said flattened main surface and further wherein said heat transfer block includes at least two clip channels disposed therein for receiving a portion of said flattened clip such that said two side surfaces of said flattened clip are disposed in said at least two clip channels.
33. The heat pipe system of claim 29 wherein said flattened clip extends substantially across an entire top surface of said heat transfer block.