Heat pipe fin stack with extruded base
View Patent ↗A heat sink has a base plate to be clamped against a heat source and one or more heat pipes containing a phase change fluid. Each heat pipe has an elongated tubular evaporator fitted in a channel in the base plate, and a columnar condenser part perpendicular to the base plate forming a structural column for air heat exchange fins. The channel in the base plate is parallel to an edge. An additional channel or ridge is provided, also parallel to the edge, for receiving a clamp or spring clip to urge the base plate against the heat source. The base plate is inexpensively extruded with the parallel channels, ridges, etc., extending across the width of the base plate parallel to the edge. The heat sink has a minimum number of inexpensive parts yet is highly thermally efficient.
1. A heat transfer device for dissipating heat from a heat source, said device comprising:
a heat pipe including a vessel to be placed in thermally conductive relation to said heat source, said heat pipe comprising thermally conductive material at least at an elongated and flattened evaporator part and including a condenser part that is in fluid communication with said flattened evaporator part;
a heat transfer medium for movement in a cycle between said evaporator part and said condenser part;
a wicking material within said heat pipe that is capable of supporting a capillary flow of said heat transfer medium at least for part of said cycle;
a base plate for at least partly supporting said heat pipe, said base plate having a surface to be directed toward said heat source, wherein said base plate has at least one channel extending across a full length of said surface of said base plate, wherein said channel is dimensioned to receive at least a portion of said elongated and flattened evaporator part of said heat pipe and said flattened evaporator part is disposed in said channel and extends substantially parallel to a plane of said base plate, so as to engage said heat source.
2. A heat transfer device according to 1 wherein said condenser part comprises an integral extension of said evaporator part.
3. A heat transfer device according to 2 wherein said condenser part extends perpendicular to said plane of said base plate.
4. A heat transfer device according to 3 further comprising an array of air heat exchange structures coupled to said condenser part.
5. A heat transfer device according to 4 wherein said air heat exchange structures comprise an array of fins.
6. A heat transfer device according to 5 wherein said fins comprise substantially parallel plates.
7. A heat transfer device according to 6 wherein said fins comprise an array of plates that are shaped by at least one of folding, rolling, corrugation, and surface irregularity.
8. A heat transfer device according to 2 wherein said base plate comprises a plurality of parallel channels coupled to a plurality of said evaporator parts.
9. A heat transfer device according to 2 wherein said heat transfer medium is a fluid.
10. A heat transfer device according to 2 wherein said heat pipe is U-shaped with said elongated and flattened evaporator part forming a bottom portion of said U-shaped heat pipe, and further wherein said elongated and flattened evaporator part is positioned in a plane perpendicular to said base plate so as to be received within said channel.
11. A heat transfer device according to 10 wherein said elongated and flattened evaporator part of said U-shape has at least one surface that is complementary with a surface of said channel.
12. A heat transfer device according to 11 wherein said elongated and flattened evaporator part has at least one flattened side surface that is complementary to said surface of said channel.
13. A heat transfer device according to 2 wherein at least one said channel is defined in a surface of said base plate facing said heat source.
14. A heat transfer device according to 2 wherein said at least one channel defined in a surface of said base plate facing away from said heat source.
15. A heat transfer device according to 2 comprising at least one of a ridge and a channel defined in a surface of said base plate and facing away from said heat source.
16. A heat transfer device according to 2 further comprising a structure for engaging a clamp for holding said base plate against said heat source, said structure for engaging said clamp comprising at least one of a ridge and an additional channel extending parallel to said channel extending across a full length of a surface of said base plate.
17. A heat transfer device according to 2 wherein said heat transfer medium is provided to cyclically undergo a phase change from liquid to vapor at said evaporator and from vapor to liquid at said condensers.
18. A heat transfer device for dissipating heat from a heat source, said device comprising:
a heat pipe including a vessel to be placed in thermally conductive relation to said heat source, said heat pipe comprising thermally conductive material at least at an elongated and at least partially flattened evaporator part;
a plurality of condenser parts that are each in fluid communication with said evaporator part;
a heat transfer medium for movement in a cycle between said evaporator and said condensers;
a wicking material within said heat pipe that is capable of supporting a capillary flow of said heat transfer medium at least for part of said cycle;
a base plate for at least partly supporting said heat pipe, said base plate having a surface to be directed toward said heat source, wherein said base plate has at least one channel extending across a full length of a surface of said base plate, wherein said channel is dimensioned to receive within its length said elongated and flattened evaporator part of said heat pipe so that said elongated and flattened evaporator part engages said heat source.
19. A heat transfer according to 18 wherein said condenser parts are substantially parallel to each other.
20. A heat transfer according to 18 wherein said condenser parts comprise an integral extension of said evaporator part.
21. A heat transfer according to 20 wherein said condenser parts are substantially perpendicular to said flattened evaporator part.
22. A heat transfer device according to 21 further comprising an array of air heat exchange structures coupled to at least one of said condenser parts of said heat pipe, and wherein said air heat exchange structures are supported by said condenser part of said heat pipe.