CTE-matched heat pipe
View Patent ↗A heat pipe having a mounting surface with a coefficient of thermal expansion matching that of silicon is disclosed, the heat pipe including a base containing aluminum nitride, a metal body, and a metal wick.
1. A heat pipe comprising a tubular body having a central passageway, an evaporator portion defining said central passageway and having an evaporator end edge, and a wick disposed on at least said evaporator portion of said tubular body, a working fluid, and a base sealingly attached to said end edge thereby sealing off said evaporator portion of said tubular body wherein said base includes aluminum nitride, an interior surface communicating with said central passageway and a mounting surface that is sized and shaped to be directly mounted to at least one silicon device.
2. The heat pipe according to claim 1 wherein said base further includes direct bond copper.
3. The heat pipe according to claim 1 wherein said wick is a brazed copper powder metal wick.
4. The heat pipe according to claim 1 wherein said body comprises copper.
5. The heat pipe according to claim 1 wherein said at least one silicon device include one or more semiconductors.
6. The heat pipe according to claim 5 wherein said semiconductors are mounted to a bottom surface of said base.
7. The heat pipe according to claim 6 wherein heat from said semiconductors is conducted directly through said base.
8. The heat pipe according to claim 7 wherein said a portion of said wick contains a working fluid.
9. The heat pipe according to claim 8 wherein said heat results in the evaporation of said working fluid.
10. The heat pipe according to claim 1 wherein said base further includes a wick structure on an inner surface that is arranged in fluid communication with said wick disposed upon at least an evaporator portion of said central passageway.
11. The heat pipe according to claim 1 wherein said base is spaced away from said wick disposed upon at least an evaporator portion of said central passageway.
12. The heat pipe according to claim 1 wherein said working fluid is selected from the group consisting of water, methanol, acetone, fluorocarbons and hydrocarbons.
13. The heat pipe according to claim 1 further comprising a secondary heat sink mounted to said body.
14. A heat pipe comprising a tubular body having a central passageway, an evaporator portion defining said central passageway and an evaporator end edge, a first wick disposed on at least said evaporator portion of said tubular body, a working fluid, and a base comprising direct bond copper aluminum nitride and having an outer surface and an inner surface, wherein said inner surface is arranged in sealing relation to said evaporator end edge and includes a second wick and said outer surface is sized and shaped to be directly mounted to at least one silicon device.
15. The heat pipe according to claim 14 wherein said second wick comprises a plurality of grooves in said inner surface.
16. The heat pipe according to claim 14 wherein said second wick comprises a sintered metal powder positioned upon said inner surface.
17. The heat pipe according to claim 14 wherein said second wick comprises a screen mesh mounted to said inner surface.
18. The heat pipe according to claim 14 wherein said first wick comprises a brazed copper powder metal and said second wick comprises a sintered metal powder positioned upon said inner surface.
19. The heat pipe according to claim 18 wherein said at least one silicon device include one or more semiconductors.
20. The heat pipe according to claim 20 wherein heat from said semiconductors is conducted to and directly through said base.
21. The heat pipe according to claim 14 wherein said second wick is spaced away from said body and said first wick is arranged in fluid communication with said second wick.