Integrated circuit heat pipe heat spreader with through mounting holes
View Patent ↗A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.
1. A heat pipe for spreading heat comprising:
a boundary structure including spaced-apart first and second plates that define an enclosed vapor chamber, and at least one spacer positioned within said vapor chamber and extending between and contacting said first and second plates;
a depression formed in said first plate which projects into said vapor chamber and is bonded to said second plate; and
an opening defined through said depression and said second plate wherein said opening is isolated from said vapor chamber.
2. A heat pipe for spreading heat according to claim 1 wherein said spaced-apart first and second plates include confronting interior surfaces; and
a wick positioned upon said confronting interior surfaces including that portion of the interior surface of said first plate that forms a surface of said depression within said vapor chamber.
3. A heat pipe for spreading heat according to claim 2 wherein said wick is constructed with at least two separate sections of different materials, with one section being located on said first plate interior surface and being formed of a material with higher heat conductivity than another section located on said second plate interior surface.
4. A heat pipe for spreading heat according to claim 1 wherein said depression comprises an annular outer surface that is bonded to a corresponding annular edge surface in said second plate.
5. A heat pipe for spreading heat according to claim 1 wherein said first and second plates each include a peripheral lip located at an edge of said boundary structure which are bonded together.
6. A heat pipe for spreading heat comprising:
a boundary structure including spaced-apart first and second plates that define an enclosed vapor chamber wherein said spaced-apart first and second plates include confronting interior surfaces;
a depression formed in said first plate which projects into said vapor chamber and is bonded to said second plate;
a wick positioned upon said confronting interior surfaces including that portion of the interior surface of said first plate that forms a surface of said depression within said vapor chamber;
an opening defined through said first plate depression and said second plate wherein said opening is isolated from said vapor chamber; and
a depression formed in said second plate which projects into said vapor chamber and is bonded to said first plate.
7. A heat pipe for spreading heat according to claim 6 wherein said depression formed in said second plate comprises a flat portion that is in contact with an inner surface of said first plate.