Granted Patent B2

US 7,149,087 · App. 11/220,456 · Granted Dec 12, 2006

Abstract

Claims (38)

1. A system for cooling electronic components, said system comprising:

a surface;

one or more electronic components including an integrated circuit mounted on said surface;

a liquid cooled heat exchanger located in overlying contacting relation with said integrated circuit; and

a resilient cold plate coupled to said surface so as to be biased by a portion of said liquid cooled heat exchanger thereby providing a loaded engagement between said liquid cooled heat exchanger, said integrated circuit, and said resilient cold plate.

2. A system according to claim 1 wherein said liquid cooled heat exchanger includes a base plate having a plurality of fins projecting outwardly from a top surface.

3. A system according to claim 2 wherein said plurality of fins are arranged in mutually parallel relation to one another.

4. A system according to claim 2 wherein end ones of said fins include a radiused outer surface.

5. A system according to claim 2 wherein said plurality of fins have a length and width that is less than a length and a width of said base plate so that a circumferential portion of said base plate forms a flange that extends outwardly from all sides of said plurality of fins.

6. A system according to claim 2 wherein said liquid cooled heat exchanger includes a lid positioned in overlying relation to said base plate, and that includes a first conduit and a second conduit.

7. A system according to claim 6 wherein said lid includes a central depression defined by a circumferential wall that is bounded by a central top wall.

8. A system according to claim 7 wherein said lid defines two through-bores in said top wall that are arranged in spaced apart relation to one another.

9. A system according to claim 7 wherein said lid includes a circumferential flange that extends outwardly from all sides of said lid and away from said central depression.

10. A system according to claim 6 wherein said lid is assembled to said base plate so that said plurality of fins are located within a central depression defined by a circumferential wall that is bounded by a central top wall of said lid.

11. A system according to claim 10 wherein said lid, said base plate and said fins define a first manifold and a second manifold.

12. A system according to claim 2 wherein said cold plate is formed from a sheet of thermally conductive, resilient metal having a top surface, a bottom surface, an opening defined by a peripheral edge through a thickness, and at least one depression.

13. A system according to claim 1 wherein said cold plate stores energy when deflected in a spring-like fashion so that a force or load is exerted by said cold plate in response to said deflection.

14. A system according to claim 12 wherein said plurality of fins have a length and width that is less than a length and a width of said base plate so that a circumferential portion of said base plate forms a flange that extends outwardly from all sides of said plurality of fins and deflects said cold plate in a spring-like fashion.

15. A system according to claim 1 wherein said resilient cold plate includes at least one depression that is formed in a top surface so as to define a prominence protruding from a bottom surface.

16. A system according to claim 1 wherein said surface forms a portion of a printed wiring board.

17. A system according to claim 1 wherein said one or more electronic components comprise graphics memory modules distributed around a perimeter of said integrated circuit.

18. A system according to claim 1 wherein said resilient cold plate includes a plurality of depressions that are formed in a top surface so as to define a plurality of prominences protruding from a bottom surface.

19. A system for cooling electronic components, said system comprising:

a surface;

a plurality of electronic components including an integrated circuit mounted on said surface;

a liquid cooled heat exchanger located in overlying contacting relation with said integrated circuit; and

a resilient cold plate coupled to said surface in overlying contacting relation with said electronic components and so as to be biased by a portion of said liquid cooled heat exchanger thereby providing a spring-loaded engagement between said liquid cooled heat exchanger, said electronic components, and said resilient cold plate.

20. A system for cooling electronic components, said system comprising:

a first surface and a second surface;

one or more electronic components including an integrated circuit mounted on at least said first surface;

a liquid cooled heat exchanger located in overlying contacting relation with said integrated circuit;

a first resilient cold plate coupled to said first surface in overlying contacting relation with said one or more electronic components and so as to be biased by a portion of said liquid cooled heat exchanger thereby providing a forced engagement between said liquid cooled heat exchanger, said one or more electronic components, and said first resilient cold plate; and

a second resilient cold plate coupled to said second surface and said first resilient cold plate.

21. A system for cooling electronic components, said system comprising:

a surface;

one or more electronic components including at least one integrated circuit mounted on said surface;

at least one liquid cooled heat exchanger located in overlying contacting relation with said at least one integrated circuit; and

at least one resilient cold plate coupled to said surface so as to be biased by a portion of said at least one liquid cooled heat exchanger thereby providing a loaded engagement between said at least one liquid cooled heat exchanger, said at least one integrated circuit, and said at least one resilient cold plate.

Assignments (17)