FLEXIBLE LOOP THERMOSYPHON
A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the inner tube acts as a condensate conduit returning liquid to the loop thermosyphon evaporator.
1 . A loop thermosyphon comprising an evaporator and a condenser that are interconnected in flow communication to one another by one conduit comprising a pair of concentrically arranged tubes.
2 . A thermal bus arranged within an electronics system for transporting thermal energy in a directed manner comprising at least one loop thermosyphon comprising an evaporator and a condenser that are interconnected in flow communication to one another by one conduit comprising a pair of concentrically arranged tubes.
3 . A thermal bus according to claim 2 wherein said inner tube comprises a melt-processable copolymer.
4 . A thermal bus according to claim 3 wherein said condenser portion comprises a vapor vessel and a liquid vessel.
5 . A thermal bus according to claim 4 wherein said liquid vessel comprises a liquid header and a vapor plenum that are separated by a bulkhead.
6 . A thermal bus according to claim 5 wherein said vapor plenum is in flow communication with said vapor vessel.
7 . A thermal bus according to claim 6 further comprising a port that passes through said bulkhead.
8 . A thermal bus according to claim 2 wherein:
said vapor transport space is in flow communication with said vapor vessel, said vapor plenum and said vapor conduit; and
said liquid header is in flow communication with said inner tube and a port.
9 . A thermal bus according to claim 8 wherein said inner tube forms an interference fit with said port.
10 . A thermal bus according to claim 8 wherein said port comprises a nipple.
11 . A loop thermosyphon according to claim 1 wherein said evaporator portion comprises a plurality of blade-evaporators that extend from a common manifold, wherein said common manifold is arranged in flow communication with each blade-evaporator and with said one conduit.
12 . A loop thermosyphon according to claim 11 wherein each blade-evaporator is joined to said common manifold so that vapor exits from each blade-evaporator to said common manifold and condensate is returned to said common manifold so as to be distributed to individual blade-evaporators.
13 . A loop thermosyphon according to claim 12 further comprising a vapor conduit hermetically engaged with said vapor plenum.
14 . A loop thermosyphon according to claim 13 further comprising a condensate conduit in flow communication with said liquid header.
15 . A loop thermosyphon according to claim 14 wherein said condensate conduit forms an interference fit with said fitting.
16 . A loop thermosyphon according to claim 15 wherein said fitting comprises a nipple.
17 . A thermal bus arranged within an electronics system for transporting thermal energy in a directed manner comprising:
an evaporator and a condenser arranged in flow communication with one another through a conduit comprising an outer tube and an inner tube that are positioned in concentric relation to one another.
18 . A thermal bus according to claim 17 wherein said evaporator and condenser are spaced apart and separated by at least one structure.
19 . A thermal bus according to claim 17 wherein said outer tube comprises a pleated wall that is formed by a plurality of circumferential folds that are arranged in parallel spaced relation to one another.
20 . A thermal bus according to claim 17 wherein said inner tube comprises at least one of Teflon FEP and Teflon PFA.