IP Library Granted Patent US 7,698,815
Granted Patent B2
US 7,698,815 · App. 10/817,170 · Granted Apr 20, 2010

Method for forming a heat dissipation device

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Quick Facts
Patent No.
US 7,698,815
App. No.
10/817,170
Granted
Apr 20, 2010
Kind
B2
Abstract

A heat sink for integrated circuits is limited substantially to heat transfer fins on one or more heat pipe tubes, the tube(s) functioning as a base for the heat sink. The heat pipe tube has a flattened oval cross-section and can snap-fit in openings through the fins. The tube is exposed on one side of the heat sink for contact with the heat generating circuit. The fins can be flat or irregular and can have a collar engaging the heat pipe tube. In one example, the heat pipe runs perpendicular to vertical fins along the bottom of a standing fin stack. In another embodiment two U-shaped heat pipe tubes carry a layered stack, the bottom of the U-shapes being presented under the lowermost in the stack. A clamp urges the heat sink against the heat source.

Claims (13)

1. A method for forming a heat transfer device for dissipating heat comprising the steps of:

arranging a plurality of fins that are formed with openings that substantially align with one another so as to define a die;

forming a collar raised around at least part of each of said openings;

driving a heat pipe into said die so as to deform the heat pipe thereby forming at least one flattened surface and wherein an outside shape of the heat pipe is complementary with said openings; and

supporting said fins upon the heat pipe such that the heat pipe substantially defines a mounting base for said heat transfer device, and is attachable to a heat source for thermal energy exchange with said heat source.

2. The method of claim 1 wherein forming a collar raised around at least part of each of said openings occurs prior to driving the heat pipe.

3. The method according to claim 1 wherein said fins are substantially exclusively supported by said at least one heat pipe.

4. The method of claim 1 including changing said outside shape of said heat pipe by driving the heat pipe on a forming surface defined by said plurality of fins.

5. The method of claim 1 wherein arranging a plurality of fins includes forming a stack of spaced-apart fins.

6. The method of claim 1 including forming the fins from substantially parallel flat sheets.

7. The method of claim 1 including deforming the heat pipe by contact with the fins.

8. The method of claim 1 including aligning the openings in the fins to define a channel, and wherein the channel has a reduction in channel width for at least partially defining the outside shape of the heat pipe.

9. The method of claim 1 including forming the heat pipe to define an oval cross-section having a flattened surface on at least one side.

Assignments (5)
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 021398/0300 Recorded Oct 28, 2016
From: NATIONAL PENN BANK
To: THERMAL CORP.; THERMACORE, INC. F/K/A FSBO VENTURE ACQUISITIONS, INC.
Reel/Frame 040508/0620 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 026039/0865 Recorded Oct 28, 2016
From: SANTANDER BANK, N.A. F/K/A SOVEREIGN BANK
To: THERMAL CORP.; THERMACORE, INC.
Reel/Frame 040508/0649 →
SECURITY AGREEMENT Recorded Jan 31, 2011
From: THERMACORE, INC.; THERMAL CORP.
To: SOVEREIGN BANK
Reel/Frame 026039/0865 →
SECURITY AGREEMENT Recorded Aug 15, 2008
From: THERMAL CORP.; FSBO VENTURE ACQUISITIONS, INC.
To: NATIONAL PENN BANK
Reel/Frame 021398/0300 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2004
From: GARNER, SCOTT
To: THERMAL CORP.
Reel/Frame 014537/0703 →