IP Library Granted Patent US 7,028,760
Granted Patent B2
US 7,028,760 · App. 11/069,260 · Granted Apr 18, 2006

Integrated circuit heat pipe heat spreader with through mounting holes

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Quick Facts
Patent No.
US 7,028,760
App. No.
11/069,260
Granted
Apr 18, 2006
Kind
B2
Abstract

A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.

Claims (47)

1. An assembly for forming a heat pipe for spreading heat comprising:

a boundary structure including spaced-apart first and second plates that define an enclosed vapor chamber having a plurality of first particles having a first melting temperature and a brazing compound comprising a plurality of second particles having a second melting temperature that is lower than said first melting temperature whereby said plurality of first particles are joined together by said brazing compound by melting said plurality of second particles such that fillets of said brazing compound are formed between adjacent ones of said plurality of first particles so as to form a network of capillary passageways between said first particles;

at least one depression formed in said first plate which projects into said vapor chamber and is bonded to said second plate; and

an opening defined through said at least one depression and said second plate wherein said opening is isolated from said vapor chamber.

2. An assembly for forming a heat pipe for spreading heat according to claim 1 comprising at least one spacer positioned within said vapor chamber and extending between and contacting said first and second plates.

3. An assembly for forming a heat pipe for spreading heat according to claim 1 wherein said spaced-apart first and second plates include confronting interior surfaces; and

a wick positioned upon said confronting interior surfaces including that portion of the interior surface of said first plate that forms a surface of said depression within said vapor chamber.

4. An assembly for forming a heat pipe for spreading heat according to claim 3 wherein said wick is constructed with at least two separate sections of different materials, with one section being located on said first plate interior surface and being formed of a material with higher heat conductivity than sections located on said second plate interior surface.

5. An assembly for forming a heat pipe for spreading heat according to claim 1 wherein said depression comprises an annular outer surface that is bonded to a corresponding annular edge surface in said second plate.

6. An assembly for forming a heat pipe for spreading heat according to claim 1 wherein said first and second plates each include a peripheral lip located at an edge of said boundary structure which are bonded together.

7. An assembly for forming a heat pipe for spreading heat according to claim 1 wherein said brazing compound comprises about sixty-five percent weight copper and thirty-five percent weight gold particles such that said fillets of said brazing compound are formed between adjacent ones of said plurality of particles so as to create a network of capillary passageways between said particles.

8. A heat pipe for spreading heat formed from the assembly of claim 1 wherein said fillets are formed by capillary action of said braze compound when in a molten state.

9. An assembly for forming a heat pipe for spreading heat according to claim 1 wherein said plurality of first particles are selected from the group consisting of carbon, tungsten, copper, aluminum, magnesium, nickel, gold, silver, aluminum oxide, and beryllium oxide.

10. An assembly for forming a heat pipe for spreading heat according to claim 1 wherein a Plurality of said plurality of first particles comprise a shape selected from the group consisting of spherical, oblate spheroid, prolate spheroid, ellipsoid, polygonal, and filament.

11. An assembly for forming a heat pipe for spreading heat according to claim 1 wherein said plurality of first particles comprise at least one of copper spheres and oblate copper spheroids having a melting point of about one thousand eighty-three° C.

12. An assembly for forming a heat pipe for spreading heat according to claim 1 wherein said brazing compound comprises six percent by weight of a finely divided copper/gold second particles.

13. An assembly for forming a heat pipe for spreading heat according to claim 1 wherein said brazing compound is present in the range from about two percent to about ten percent.

14. An assembly for forming a heat pipe for spreading heat according to claim 1 wherein said plurality of first particles comprise copper powder comprising particles sized in a range from about twenty mesh to about two-hundred mesh.

15. An assembly for forming a heat pipe for spreading heat according to claim 1 wherein said braze compound second particles comprise about minus three hundred and twenty-five mesh.

16. An assembly for forming a heat pipe for spreading heat according to claim 1 wherein said second particles that are a constituent portion of said braze compound comprise a smaller size than said plurality of first particles.

17. An assembly for forming a heat pipe for spreading heat according to claim 1 wherein said braze compound is selected from the group consisting of nickel-based Nicrobrazes, silver/copper brazes, tin/silver, lead/tin, and polymers.

18. An assembly for forming a heat pipe for spreading heat according to claim 1 wherein said plurality of first particles comprise aluminum and magnesium and said brazing compound comprises an aluminum/magnesium intermetallic alloy second particles.

19. An assembly for forming a heat pipe for spreading heat comprising:

a boundary structure including spaced-apart first and second plates that define an enclosed vapor chamber having a plurality of first particles having a first melting temperature and a brazing compound comprising a plurality of second particles having a second melting temperature that is lower than said first melting temperature whereby said plurality of first particles are joined together by said brazing compound by melting said plurality of second particles such that fillets of said brazing compound are formed between adjacent ones of said plurality of first particles so as to form a network of capillary passageways between said first particles;

at least one depression formed in said first plate which projects into said vapor chamber and is bonded to said second plate;

an opening defined through said first plate depression and said second plate wherein said opening is isolated from said vapor chamber; and

at least one depression formed in said second plate which projects into said vapor chamber and is bonded to said first plate.

20. An assembly for forming a heat pipe for spreading heat according to claim 19 wherein said at least one depression formed in said second plate comprises a flat portion that is in contact with an inner surface of said first plate.

21. An assembly for forming a heat pipe for spreading heat according to claim 19 wherein said spaced-apart first and second plates include confronting interior surfaces; and

a wick positioned upon said confronting interior surfaces including that portion of the interior surface of said first plate that forms a surface of said depression within said vapor chamber.

22. An assembly for forming a heat pipe for spreading heat according to claim 19 wherein said brazing compound comprises about sixty-five percent weight copper and thirty-five percent weight gold particles such that said assembly is heated so as to melt said plurality of second particles, said fillets of said brazing compound are formed between adjacent ones of said plurality of particles so as to create a network of capillary passageways between said particles.

23. A heat pipe for spreading heat formed from the assembly of heat claim 19 wherein said fillets are formed by capillary action of said braze compound when in a molten state.

24. An assembly for forming a heat pipe for spreading heat according to claim 19 wherein said plurality of first particles are selected from the group consisting of carbon, tungsten, copper, aluminum, magnesium, nickel, gold, silver, aluminum oxide, and beryllium oxide.

25. An assembly for forming a heat pipe for spreading heat according to claim 19 wherein said plurality of first particles comprise a shape selected from the group consisting of spherical, oblate spheroid, prolate spheroid, ellipsoid, polygonal, and filament.

26. An assembly for forming a heat pipe for spreading heat according to claim 19 wherein said plurality of first particles comprise at least one of copper spheres and oblate copper spheroids having a melting point of about one thousand eighty-three° C.

27. An assembly for forming a heat pipe for spreading heat according to claim 22 wherein said brazing compound comprises six percent by weight of a finely divided copper/gold second particles.

28. An assembly for forming a heat pipe for spreading heat according to claim 22 wherein said brazing compound is present in the range from about two percent to about ten percent.

29. An assembly for forming a heat pipe for spreading heat according to claim 22 wherein said plurality of first particles comprise copper powder comprising particles size in a range from about twenty mesh to about two-hundred mesh.

30. An assembly for forming a heat pipe for spreading heat according to claim 22 wherein said second particles of said braze compound comprise about minus three hundred and twenty-five mesh.

31. An assembly for forming a heat pipe for spreading heat according to claim 19 wherein said plurality of second particles that are a constituent portion of said braze compound comprise a smaller size than said plurality of first particles.

32. An assembly for forming a heat pipe for spreading heat according to claim 19 wherein plurality of second particles that form said braze compound are selected from the group consisting of nickel-based Nicrobrazes, silver/copper brazes, tin/silver, lead/tin, and polymers.

33. An assembly for forming a heat pipe for spreading heat according to claim 19 wherein said plurality of first particles comprise aluminum and magnesium and said plurality of second particles that form said brazing compound comprise an aluminum/magnesium intermetallic alloy.

34. An assembly for forming a heat pipe for spreading heat comprising:

a boundary structure including spaced-apart first and second plates that define an enclosed vapor chamber having a plurality of first particles having a first melting temperature and a brazing compound comprising a plurality of second particles having a second melting temperature that is lower than said first melting temperature whereby said plurality of first particles are joined together by said brazing compound by melting said plurality of second particles such that fillets of said brazing compound are formed between adjacent ones of said plurality of first particles so as to form a network of capillary passageways between said first particles;

at least one hollow column positioned within said vapor chamber and sealingly bonded to said first and second plates, having an open first end that opens through said first plate and an open second end that opens through said second plate so as to form at least one mounting hole that is isolated from said vapor chamber.

35. An assembly for forming a heat pipe for spreading heat according to claim 34 wherein said spaced-apart first and second plates include confronting interior surfaces; and

wherein a mixture of said plurality of first and second particles is positioned upon said confronting interior surfaces of said first and second plates the exterior surface of said at least one hollow column disposed within said vapor chamber.

Assignments (14)
RELEASE (REEL047028/FRAME0743) Recorded Jul 30, 2024
From: ROYAL BANK OF CANADA
To: LTI FLEXIBLE PRODUCTS, INC.; LIFETIME INDUSTRIES, INC.; AAVID THERMALLOY, LLC (NOW KNOWN AS BOYD LACONIA, LLC; NUVENTIX, INC.; THERMAL CORP. (NOW KNOWN AS AAVID THERMAL CORP.; CSI MEDICAL, INC.
Reel/Frame 068195/0243 →
RELEASE OF SECOND LIEN SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (042477/0643) Recorded Sep 10, 2018
From: ANTARES CAPITAL LP, AS ADMINISTRATIVE AND COLLATERAL AGENT
To: LTI HOLDINGS, INC.; AAVID NIAGARA, LLC; AAVID THERMACORE, INC.; AAVID THERMAL CORP.; AAVID THERMALLOY, LLC; LIFETIME INDUSTRIES, INC.; LTI FLEXIBLE PRODUCTS, INC.; NUVENTIX, INC.
Reel/Frame 047223/0380 →
RELEASE OF FIRST LIEN SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (042477/0565) Recorded Sep 10, 2018
From: ANTARES CAPITAL LP, AS ADMINISTRATIVE AND COLLATERAL AGENT
To: LTI HOLDINGS, INC.; AAVID NIAGARA, LLC; AAVID THERMACORE, INC.; AAVID THERMAL CORP.; AAVID THERMALLOY, LLC,; LIFETIME INDUSTRIES, INC.; LTI FLEXIBLE PRODUCTS, INC.; NUVENTIX, INC.
Reel/Frame 047052/0001 →
SECOND LIEN SECURITY INTEREST Recorded Sep 7, 2018
From: LTI FLEXIBLE PRODUCTS, INC.; LIFETIME INDUSTRIES, INC.; AAVID THERMALLOY, LLC; NUVENTIX, INC.; AAVID THERMAL CORP. (F/K/A THERMAL CORP.); CSI MEDICAL, INC.
To: ROYAL BANK OF CANADA
Reel/Frame 047028/0743 →
FIRST LIEN SECURITY INTEREST Recorded Sep 6, 2018
From: LTI FLEXIBLE PRODUCTS, INC.; LIFETIME INDUSTRIES, INC.; AAVID THERMALLOY, LLC; NUVENTIX, INC.; AAVID THERMAL CORP. (F/K/A THERMAL CORP.); CSI MEDICAL, INC.
To: ROYAL BANK OF CANADA
Reel/Frame 047026/0666 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 40355/0672 Recorded May 23, 2017
From: ANTARES CAPITAL LP, AS SUCCESSOR TO GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
To: THERMAL CORP.
Reel/Frame 042554/0151 →
SECOND LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded May 16, 2017
From: LTI HOLDINGS, INC.; AAVID NIAGARA, LLC; AAVID THERMACORE, INC.; AAVID THERMAL CORP.; AAVID THERMALLOY, LLC; LIFETIME INDUSTRIES, INC.; LTI FLEXIBLE PRODUCTS, INC.; NUVENTIX, INC.
To: ANTARES CAPITAL LP, AS AGENT
Reel/Frame 042477/0643 →
FIRST LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded May 16, 2017
From: LTI HOLDINGS, INC.; AAVID NIAGARA, LLC; AAVID THERMACORE, INC.; AAVID THERMAL CORP.; AAVID THERMALLOY, LLC; LIFETIME INDUSTRIES, INC.; LTI FLEXIBLE PRODUCTS, INC.; NUVENTIX, INC.
To: ANTARES CAPITAL LP, AS AGENT
Reel/Frame 042477/0565 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 3, 2017
From: THERMAL CORP.
To: AAVID THERMALLOY, LLC
Reel/Frame 041455/0769 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 021398/0300 Recorded Oct 28, 2016
From: NATIONAL PENN BANK
To: THERMAL CORP.; THERMACORE, INC. F/K/A FSBO VENTURE ACQUISITIONS, INC.
Reel/Frame 040508/0620 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 026039/0865 Recorded Oct 28, 2016
From: SANTANDER BANK, N.A. F/K/A SOVEREIGN BANK
To: THERMAL CORP.; THERMACORE, INC.
Reel/Frame 040508/0649 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 035134/0363 Recorded Oct 20, 2016
From: PINE STREET CAPITAL PARTNERS II, L.P.
To: THERMAL CORP.
Reel/Frame 040425/0584 →
SECURITY INTEREST Recorded Oct 14, 2016
From: THERMAL CORP.
To: ANTARES CAPITAL LP, AS AGENT
Reel/Frame 040355/0672 →
SECURITY INTEREST Recorded Mar 6, 2015
From: THERMAL CORP.
To: PINE STREET CAPITAL PARTNERS II, L.P.
Reel/Frame 035134/0363 →