IP Library Assignment 021795/0891
Patent Assignment
Reel/Frame 021795/0891

Assignment of Assignor's Interest

Recorded: 2008-11-06 Pages: 2
Assignors
UENO, MASAAKI
Executed: 2008-10-20
HAYASHIDA, AKIRA
Executed: 2008-10-20
SHIMADA, MASAKAZU
Executed: 2008-10-21
OKA, TAKENORI
Executed: 2008-10-11
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU,, TOKYO, 101-8980, JAPAN
Covered Property (1)
Substrate Processing Apparatus, Coolant Gas Supply Nozzle and Semiconductor Device Manufacturing Method
Patent: 8,148,271 →
Application: 11/989,698 →
Publication: US 2009/0291566
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →