Patent Assignment
Reel/Frame 021804/0161
Assignment of Assignor's Interest
Recorded: 2008-11-07
Pages: 3
Assignor
SHIKANO, TAKETOSHI
Executed: 2008-10-17
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Semiconductor Device Having a Semiconductor Chip and Resin Sealing Portion