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Patent Assignment
Reel/Frame 021813/0086

Assignment of Assignor's Interest

Recorded: 2008-11-11 Pages: 8
Assignors
CHOU, CHIEN-KANG
Executed: 2006-05-03
CHOU, CHIU-MING
Executed: 2006-05-04
LEE, JIN-YUAN
Executed: 2006-05-04
LIN, MOU-SHIUNG
Executed: 2006-05-08
LEE, WEN-CHIEH
Executed: 2006-05-03
LIU, YI-CHENG
Executed: 2006-05-04
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD.,, HSINCHU, 300, TAIWAN
Covered Property (1)
Semiconductor Chip with Coil Element Over Passivation Layer
Patent: 7,470,927 →
Application: 11/434,861 →
Publication: US 2006/0263727
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →