Patent Assignment
Reel/Frame 021830/0055
Assignment of Assignor's Interest
Recorded: 2008-11-13
Pages: 5
Assignors
LEE, BYOUNG HWA
Executed: 2008-10-15
WI, SUNG KWON
Executed: 2008-10-15
CHUNG, HAE SUK
Executed: 2008-10-15
PARK, DONG SEOK
Executed: 2008-10-15
PARK, SANG SOO
Executed: 2008-10-15
PARK, MIN CHEOL
Executed: 2008-10-15
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Chip Capacitor, Motherboard Apparatus Having the Same, and Power Distribution Network