Patent Assignment
Reel/Frame 021835/0984
Assignment of Assignor's Interest
Recorded: 2008-11-14
Pages: 8
Assignors
PARK, JIN-HO
Executed: 2008-11-14
CHOI, GIL-HEYUN
Executed: 2008-11-14
LEE, SANG-WOO
Executed: 2008-11-14
PARK, JUN-HO
Executed: 2008-11-14
LEE, HO-KI
Executed: 2008-11-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 000, KOREA, REPUBLIC OF
Covered Property
(1)
Method Forming Contact Plug for Semiconductor Device Using H2 Remote Plasma Treatment