Patent Assignment
Reel/Frame 021841/0590
Assignment of Assignor's Interest
Recorded: 2008-11-12
Pages: 2
Assignor
HUFF, MICHAEL A.
Executed: 2008-11-04
Assignee
CORPORATION FOR NATIONAL RESEARCH INITIATIVES
1895 PRESTON WHITE DRIVE - SUITE 100, RESTON, VIRGINIA, 20191-5434
Covered Property
(1)
A Method of Using Low-Temperature Wafer Bonding to Bond Semiconductor Substrates to Metal Substrates