Assignment of Assignor's Interest

Recorded: 2008-11-03 Pages: 3

Assignor

TOMITA, RYUJI

Executed: 2008-10-20

Assignee

NEC ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN

Covered Property (1)

Clamp ring for wafer and method of manufacturing semiconductor apparatus

Application: 12/289,740 →

Publication: US 2009/0137096

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.