Patent Assignment
Reel/Frame 021862/0138
Assignment of Assignor's Interest
Recorded: 2008-11-19
Pages: 4
Assignors
LEE, JEONG HO
Executed: 2008-11-10
PARK, YOUNG HOON
Executed: 2008-11-10
JUNG, SANG IL
Executed: 2008-11-10
YANG, JUN SEOK
Executed: 2008-11-10
SHIN, AN CHUL
Executed: 2008-11-10
JUNG, MIN YOUNG
Executed: 2008-11-10
Assignee
SAMSUNG ELECTRONICS CO., LTD
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Metal Interconnection and Method of Fabricating Image Sensor Using the Same