Assignment of Assignor's Interest

Recorded: 2008-11-21 Pages: 8

Assignors

PERIAMAN, SHANGGAR

Executed: 2007-05-23

OOI, KOOI C.

Executed: 2007-05-24

CHEW, YEN H.

Executed: 2007-05-24

CHEAH, BOK E.

Executed: 2007-05-24

Assignee

INTEL CORPORATION

2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052

Covered Property (1)

Die Backside Metallization and Surface Activated Bonding for Stacked Die Packages

Patent: 8,110,930 →

Application: 11/820,454 →

Publication: US 2008/0315421

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.