Patent Assignment
Reel/Frame 021885/0337
Assignment of Assignor's Interest
Recorded: 2008-11-25
Pages: 3
Assignor
LEE, KI-SUB
Executed: 2008-10-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO,, 442-742, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Filling a Trench in a Substrate