IP Library › Assignment 021889/0569
Patent Assignment
Reel/Frame 021889/0569

Assignment of Assignor's Interest

Recorded: 2008-11-25 Pages: 7
Assignors
CHO, YOUNG-KYU
Executed: 2008-11-19
IM, KI-VIN
Executed: 2008-11-19
CHOI, YONG-HEE
Executed: 2008-11-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, PALDAL-GU, SUWON-CITY, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Method of Manufacturing Semiconductor Devices Including Capacitor Support Pads
Patent: 7,871,891 →
Application: 12/137,634 →
Publication: US 2009/0068814