Change of Name

Recorded: 2008-11-20 Pages: 3

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Assignor

MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Executed: 2008-10-01

Assignee

PANASONIC CORPORATION

1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN

Covered Property (1)

Semiconductor Device, Which Employs an Interlayer Insulating Film of a Low Mechanical Strength and a Highly Reliable Metal Pad, and a Method of Manufacturing the Same

Patent: 7,202,565 →

Application: 10/933,423 →

Publication: US 2005/0054188

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.

Assignment of Assignor's Interest Sep 3, 2004

From: MATSUURA, MASAZUMI; HORIBE, HIROSHI; MATSUMOTO, SUSUMU; HAMATANI, TSUYOSHI

To: RENESAS TECHNOLOGY CORP.; MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Reel/Frame 015793/0435 →

Change of Name Sep 10, 2010

From: RENESAS TECHNOLOGY CORP.

To: RENESAS ELECTRONICS CORPORATION

Reel/Frame 024973/0001 →