Patent Assignment
Reel/Frame 021908/0760
Assignment of Assignor's Interest
Recorded: 2008-11-19
Pages: 3
Assignor
MITSUZONO, SHINJI
Executed: 2008-11-12
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Method of manufacturing wiring board, wiring board, and semiconductor device
Application:
12/292,434 →
Publication:
US 2009/0151986
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.