IP Library › Assignment 021922/0335
Patent Assignment
Reel/Frame 021922/0335

Assignment of Assignor's Interest

Recorded: 2008-12-03 Pages: 4
Assignors
PARK, JUNG KYU
Executed: 2008-10-29
KO, KUN YOO
Executed: 2008-10-29
PARK, YOUNG SAM
Executed: 2008-10-29
CHOI, SEUNG HWAN
Executed: 2008-10-29
KIM, IL KU
Executed: 2008-10-29
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN3-DONG, YEONGTONG-GU, SUWON,, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
High Power Light Emitting Diode Package and Manufacturing Method Thereof
Application: 12/327,552 →
Publication: US 2009/0166664
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →