Patent Assignment
Reel/Frame 021929/0129
Assignment of Assignor's Interest
Recorded: 2008-11-24
Pages: 3
Assignors
TOGAWA, TETSUJI
Executed: 2008-11-10
NAMIKI, KEISUKE
Executed: 2008-11-10
YAMAKI, SATORU
Executed: 2008-11-10
Assignee
EBARA CORPORATION
11-1, HANEDA ASAHI-CHO, OHTA-KU, TOKYO, JAPAN
Covered Property
(1)
Method and Apparatus for Dressing Polishing Pad, Profile Measuring Method, Substrate Polishing Apparatus, and Substrate Polishing Method