Patent Assignment
Reel/Frame 021932/0228
Assignment of Assignor's Interest
Recorded: 2008-12-05
Pages: 5
Assignors
SEO, JOON-MO
Executed: 2008-12-03
KANG, BYOUNG-UN
Executed: 2008-12-03
WI, KYUNG-TAE
Executed: 2008-12-03
KIM, JAE-HOON
Executed: 2008-12-03
SUNG, TAE-HYUN
Executed: 2008-12-03
HYUN, SOON-YOUNG
Executed: 2008-12-03
LEE, BYOUNG-KWANG
Executed: 2008-12-03
CHOI, CHAN-YOUNG
Executed: 2008-12-03
Assignee
LS CABLE LTD.
19-20F ASEM TOWER 159, SAMSUNG-DONG, GANGNAM-GU, SEOUL, 135-090, KOREA, REPUBLIC OF
Covered Property
(1)
Dicing Die Attachment Film and Method for Packaging Semiconductor Using Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.