Dicing die attachment film and method for packaging semiconductor using same
View Patent ↗A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.
1. A dicing die attachment film, comprising:
a die attachment layer attached to one surface of a semiconductor wafer;
a dicing film layer attached to a dicing die that is used for cutting the semiconductor wafer into die units; and
an intermediate layer laminated between the die attachment layer and the dicing film layer, wherein the intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.
2. The dicing die attachment film according to claim 1 , wherein a change rate of a storage modulus of the intermediate layer (a storage modulus at 120° C./a storage modulus at 25° C.) is 0.001 to 1.
3. The dicing die attachment film according to claim 1 , wherein the intermediate layer has an elongation of 10 to 700%.
4. The dicing die attachment film according to claim 1 , wherein the intermediate layer has a thickness of 5 to 100 μm.
5. The dicing die attachment film according to claim 1 , wherein an adhesive force between the die attachment layer and the intermediate layer is lower than an adhesive force between the intermediate layer and the dicing film layer.
6. The dicing die attachment film according to claim 1 , wherein an adhesive force between the die attachment layer and the intermediate layer is 2 gf/in to 100 gf/in.
7. The dicing die attachment film according to claim 1 , wherein the intermediate layer is made of polyethylene terephthalate (PET) or polyethylene-2,6-naphthaledicarboxylate (PEN).
8. The dicing die attachment film according to claim 1 , further comprising an adhesive layer provided between the intermediate layer and the dicing film layer.
9. The dicing die attachment film according to claim 1 , wherein the die attachment layer is made of polyimide-based resin or epoxy-based resin.
10. The dicing die attachment film according to claim 1 , wherein the dicing film layer is made of polyolefin-based resin.
11. A method for packaging a semiconductor, comprising:
(a) preparing a dicing die attachment film that includes a die attachment layer attached to one surface of a semiconductor wafer, a dicing film layer attached to a dicing die that is used for cutting the semiconductor wafer into die units, and an intermediate layer laminated between the die attachment layer and the dicing film layer, the intermediate layer having a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer;
(b) attaching the dicing die attachment layer to a surface of a semiconductor wafer;
(c) cutting the semiconductor wafer into die units;
(d) expanding the dicing die attachment film such that dies are more widely spaced apart from each other;
(e) inserting a pin from the dicing film layer of the dicing die attachment film so as to bend the dicing die attachment film; and
(f) picking up an individual die to which the die attachment layer is attached.
12. The method for packaging a semiconductor according to claim 11 , further comprising: mounting the picked-up die to a substrate.
13. The method for packaging a semiconductor according to claim 12 , after the mounting of the picked-up die to the substrate, further comprising:
bonding the mounted die by applying a temperature of 100° C. to 250° C. and a pressure of 0.5 MPa to 5 MPa thereto.
14. The dicing die attachment film according to claim 5 , wherein an adhesive force between the die attachment layer and the intermediate layer is 2 gf/in to 100 gf/in.