Patent Assignment
Reel/Frame 021935/0459
Assignment of Assignor's Interest
Recorded: 2008-12-02
Pages: 4
Assignor
KATO, TADAHIRO
Executed: 2008-10-30
Assignee
SHIN-ETSU HANDOTAI CO., LTD.
6-2, OHTEMACHI 2-CHOME CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Wafer Production Method