IP Library Assignment 021974/0819
Patent Assignment
Reel/Frame 021974/0819

Assignment of Assignor's Interest

Recorded: 2008-12-14 Pages: 4
Assignor
JEONG, EUN-SOO
Executed: 2008-10-28
Assignee
DONGBU HITEK CO., LTD.
891-10 DAECHI-DONG, GANGNAM-GU, SEOUL, 135-280, KOREA, REPUBLIC OF
Covered Property (1)
Interconnect Structure and Method of Manufacturing the Same
Patent: 7,879,719 →
Application: 12/334,505 →
Publication: US 2009/0160064
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD.
Reel/Frame 044559/0819 →
Assignment of Assignor's Interest Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →