IP Library Assignment 021983/0168
Patent Assignment
Reel/Frame 021983/0168

Assignment of Assignor's Interest

Recorded: 2008-12-04 Pages: 2
Assignor
SAEKI, YOSHIHIRO
Executed: 2008-11-05
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN
Covered Property (1)
Semiconductor Device Fabricating Method and Fabricating Apparatus
Patent: 8,003,437 →
Application: 12/314,117 →
Publication: US 2009/0155953
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
Assignment of Assignor's Interest Apr 11, 2022
From: LAPIS SEMICONDUCTOR CO., LTD.
To: ACHLYS TECHNOLOGIES INC.
Reel/Frame 059559/0280 →
Assignment of Assignor's Interest Jun 19, 2022
From: ACHLYS TECHNOLOGIES INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 060244/0398 →