Patent Assignment
Reel/Frame 021987/0809
Assignment of Assignor's Interest
Recorded: 2008-12-16
Pages: 4
Assignor
WEISSBACH, ERNST-A.
Executed: 2008-09-25
Assignee
HTC BETEILIGUNGS GMBH
ANDREAS-HERZ-STRASSE 4, BALDHAM, 85598, GERMANY
Covered Property
(1)
Method for Exchanging Semiconductor Chip of Flip-Chip Module and Flip-Chip Module Suitable Therefor
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 23, 2009
From: ERTL, JUERGEN
To: HTC-B BETEILIGUNGS GMBH
Reel/Frame 022588/0630 →
Assignment of Assignor's Interest
Mar 27, 2015
From: HTC BETEILIGUNGS GMBH
To: RPX CORPORATION
Reel/Frame 035279/0362 →
Security Agreement
Mar 9, 2016
From: RPX CORPORATION; RPX CLEARINGHOUSE LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038041/0001 →
Release (Reel 038041 / Frame 0001)
Jan 2, 2018
From: JPMORGAN CHASE BANK, N.A.
To: RPX CORPORATION; RPX CLEARINGHOUSE LLC
Reel/Frame 044970/0030 →
Security Interest
Jun 29, 2018
From: RPX CORPORATION
To: JEFFERIES FINANCE LLC
Reel/Frame 046486/0433 →
Release of Lien on Patents
Dec 12, 2019
From: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
To: RPX CORPORATION
Reel/Frame 051261/0517 →
Assignment of Assignor's Interest
Dec 25, 2019
From: RPX CORPORATION
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 051364/0328 →
Release of Security Interest
Oct 26, 2020
From: JEFFERIES FINANCE LLC
To: RPX CORPORATION
Reel/Frame 054486/0422 →