Patent Assignment
Reel/Frame 035279/0362
Assignment of Assignor's Interest
Recorded: 2015-03-27
Pages: 5
Assignor
HTC BETEILIGUNGS GMBH
Executed: 2015-03-26
Assignee
RPX CORPORATION
ONE MARKET PLAZA, STEUART TOWER, SUITE 800, SAN FRANCISCO, CALIFORNIA, 94105
Covered Properties
(2)
Flip-Chip Module and Method for the Production Thereof
Method for Exchanging Semiconductor Chip of Flip-Chip Module and Flip-Chip Module Suitable Therefor
Related Assignments
(10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 16, 2008
From: WEISSBACH, ERNST-A.
To: HTC BETEILIGUNGS GMBH
Reel/Frame 021987/0809 →
Assignment of Assignor's Interest
Dec 16, 2008
From: WEISSBACH, ERNST-A.
To: HTC BETEILIGUNGS GMBH
Reel/Frame 021987/0761 →
Assignment of Assignor's Interest
Apr 23, 2009
From: ERTL, JUERGEN
To: HTC-B BETEILIGUNGS GMBH
Reel/Frame 022588/0630 →
Assignment of Assignor's Interest
Nov 10, 2010
From: ERTL, JUERGEN
To: HTC BETEILIGUNGS GMBH
Reel/Frame 025340/0008 →
Security Agreement
Mar 9, 2016
From: RPX CORPORATION; RPX CLEARINGHOUSE LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038041/0001 →
Release (Reel 038041 / Frame 0001)
Jan 2, 2018
From: JPMORGAN CHASE BANK, N.A.
To: RPX CORPORATION; RPX CLEARINGHOUSE LLC
Reel/Frame 044970/0030 →
Security Interest
Jun 29, 2018
From: RPX CORPORATION
To: JEFFERIES FINANCE LLC
Reel/Frame 046486/0433 →
Release of Lien on Patents
Dec 12, 2019
From: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
To: RPX CORPORATION
Reel/Frame 051261/0517 →
Assignment of Assignor's Interest
Dec 25, 2019
From: RPX CORPORATION
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 051364/0328 →
Release of Security Interest
Oct 26, 2020
From: JEFFERIES FINANCE LLC
To: RPX CORPORATION
Reel/Frame 054486/0422 →