Patent Assignment
Reel/Frame 025340/0008
Assignment of Assignor's Interest
Recorded: 2010-11-10
Pages: 3
Assignor
ERTL, JUERGEN
Executed: 2007-01-31
Assignee
HTC BETEILIGUNGS GMBH
ANDREAS-HERZ-STR. 4, BALDHAM, 85598, GERMANY
Covered Property
(1)
Flip-Chip Module and Method for the Production Thereof
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 16, 2008
From: WEISSBACH, ERNST-A.
To: HTC BETEILIGUNGS GMBH
Reel/Frame 021987/0761 →
Assignment of Assignor's Interest
Mar 27, 2015
From: HTC BETEILIGUNGS GMBH
To: RPX CORPORATION
Reel/Frame 035279/0362 →
Security Agreement
Mar 9, 2016
From: RPX CORPORATION; RPX CLEARINGHOUSE LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038041/0001 →
Release (Reel 038041 / Frame 0001)
Jan 2, 2018
From: JPMORGAN CHASE BANK, N.A.
To: RPX CORPORATION; RPX CLEARINGHOUSE LLC
Reel/Frame 044970/0030 →
Security Interest
Jun 29, 2018
From: RPX CORPORATION
To: JEFFERIES FINANCE LLC
Reel/Frame 046486/0433 →
Release of Security Interest
Oct 26, 2020
From: JEFFERIES FINANCE LLC
To: RPX CORPORATION
Reel/Frame 054486/0422 →