IP Library › Assignment 021990/0070
Patent Assignment
Reel/Frame 021990/0070

Assignment of Assignor's Interest

Recorded: 2008-12-16 Pages: 5
Assignors
GOH, KIM-YONG
Executed: 2008-12-12
LUAN, JING-EN
Executed: 2008-12-12
Assignee
STMICROELECTRONICS, INC.
1310 ELECTRONICS DRIVE, MAIL STATION 2346, CARROLLTON, TEXAS, 75006-5039
Covered Property (1)
Chip Scale Package Structure with Can Attachment
Patent: 8,164,179 →
Application: 12/336,422 →
Publication: US 2010/0148347
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 2, 2009
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS ASIA PACIFIC PTE LTD (SINGAPORE)
Reel/Frame 022187/0797 →
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068434/0215 →