IP Library › Assignment 022187/0797
Patent Assignment
Reel/Frame 022187/0797

Assignment of Assignor's Interest

Recorded: 2009-02-02 Pages: 3
Assignor
STMICROELECTRONICS, INC.
Executed: 2009-01-27
Assignee
STMICROELECTRONICS ASIA PACIFIC PTE LTD (SINGAPORE)
5A SERAGOON NORTH AVENUE 5, SINGAPORE, 554574, SINGAPORE
Covered Property (1)
Chip Scale Package Structure with Can Attachment
Patent: 8,164,179 →
Application: 12/336,422 →
Publication: US 2010/0148347
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 16, 2008
From: GOH, KIM-YONG; LUAN, JING-EN
To: STMICROELECTRONICS, INC.
Reel/Frame 021990/0070 →
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068434/0215 →