Assignment of Assignor's Interest

Recorded: 2008-12-15 Pages: 3

Assignor

DNP FINE ELECTRONICS CO., LTD.

Executed: 2008-11-10

Assignee

DAI NIPPON PRINTING CO., LTD.

1-1, KAGO-CHO 1-CHOME, ICHIGAYA, SHINJUKU-KU, TOKYO, JAPAN

Covered Properties (3)

Wiring Board Provided with Passive Element and Cone Shaped Bumps

Patent: 6,872,893 →

Application: 10/160,179 →

Publication: US 2002/0179329

Method for Fabricating Wiring Board Provided with Passive Element

Patent: 7,100,276 →

Application: 11/023,499 →

Publication: US 2005/0126820

Method for Fabricating Wiring Board Provided with Passive Element, and Wiring Board Provided with Passive Element

Patent: 7,679,925 →

Application: 11/489,544 →

Publication: US 2006/0254050

Related Assignments (1)

Other recorded transfers of the patents in this record — the chain of ownership.