Method for fabricating wiring board provided with passive element
View Patent ↗A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.
1. A method for fabricating a wiring board provided with a passive element, comprising:
coating a resistive paste and/or a dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has the first surface and a second surface;
arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board;
forming a double-sided wiring board by stacking, pressurizing and heating three, that is, the arranged first metal foil, insulating board, and second metal foil to integrate these; and
patterning the first metal foil and/or the second metal foil of the formed double-sided wiring board.
2. A method for fabricating a wiring board provided with a passive element as set forth in claim 1 , further comprising:
forming a substantially conical conductive bump on the first surface of the first metal foil;
wherein the forming a double-sided wiring board is performed so that the formed conductive bump penetrates through the insulating board and establishes an electrical contact with the second metal foil.
3. A method for fabricating a wiring board provided with a passive element as set forth in claim 1 :
wherein the patterning the first metal foil and/or the second metal foil includes formation of an inductor that is vortically formed due to a pattern and/or a loop antenna that is formed loop-like due to a pattern.
4. A method for fabricating a wiring board provided with a passive element as set forth in claim 1 , further comprising:
trimming a resistor formed from the resistive paste by use of the patterned first metal foil and/or the patterned second metal foil as an electrode.
5. A method for fabricating a wiring board provided with a passive element as set forth in claim 1 :
wherein the coating the resistive paste and/or the dielectric paste includes removing a periphery portion thereof after the coating.
6. A method for fabricating a wiring board provided with a passive element as set forth in claim 1 , further comprising:
forming a substantially conical conductive bump on a first surface of a third metal foil having the first surface and a second surface;
arranging a second insulating board having thermo-plasticity and thermosetting properties so as to face the first surface of the third metal foil, and arranging the first metal foil side of the double-sided wiring board so as to face a surface different from a surface that faces the third metal foil of the second insulating board;
forming a three-layered wiring board by stacking, pressurizing and heating three, that is, the arranged third metal foil, second insulating board, and double-sided wiring board to integrate these so that the conductive bump formed on the third metal foil penetrates through the second insulating board and establishes an electrical contact with the first metal foil; and
patterning the third metal foil of the formed three-layered wiring board.
7. A method for fabricating a wiring board provided with a passive element as set forth in claim 6 :
wherein the patterning the third metal foil includes formation of an inductor that is vortically formed due to a pattern and/or a loop antenna that is formed loop-like due to a pattern.
8. A method for fabricating a wiring board provided with a passive element as set forth in claim 1 , further comprising:
forming a substantially conical conductive bump on the second surface of the second metal foil of the formed double-sided wiring board;
arranging a second insulating board having thermo-plasticity and thermosetting properties so as to face a side on which the conductive bump of the double-sided wiring board is formed, and arranging a third metal foil so as to face a surface different from a surface that faces the double-sided wiring board of the second insulating board;
forming a three-layered wiring board by stacking, pressurizing and heating three, that is, the arranged double-sided wiring board, second insulating board, and third metal foil to integrate these so that the conductive bump formed on the double-sided wiring board penetrates through the second insulating board and establishes an electrical contact with the third metal foil; and
patterning the third metal foil of the formed three-layered wiring board.
9. A method for fabricating a wiring board provided with a passive element as set forth in claim 8 :
wherein the patterning the third metal foil includes formation of an inductor that is vortically formed due to a pattern and/or a loop antenna that is formed loop-like due to a pattern.
10. A method for fabricating a wiring board provided with a passive element as set forth in claim 1 , further comprising:
coating a resistive paste and/or a dielectric paste on a first surface of a third metal foil having the first surface and a second surface;
forming a substantially conical conductive bump on the second surface of the second metal foil of the formed double-sided wiring board;
arranging a second insulating board having thermo-plasticity and thermosetting properties so as to face a side on which the conductive bump of the double-sided wiring board is formed, and arranging the first surface side of the third metal foil so as to face a surface different from a surface that faces the double-sided wiring board of the second insulating board;
forming a three-layered wiring board by stacking, pressurizing and heating three, that is, the arranged double-sided wiring board, second insulating board, and third metal foil to integrate these so that the conductive bump formed on the double-sided wiring board penetrates through the second insulating board and establishes an electrical contact with the third metal foil; and
patterning the third metal foil of the formed three-layered wiring board.
11. A method for fabricating a wiring board provided with a passive element as set forth in claim 10 :
wherein the patterning the third metal foil includes formation of an inductor that is vortically formed due to a pattern and/or a loop antenna that is formed loop-like due to a pattern.
12. A method for fabricating a wiring board provided with a passive element as set forth in claim 10 :
wherein the coating a resistive paste and/or a dielectric paste on the first surface of the third metal foil includes removing a periphery portion thereof after the coating.
13. A method for fabricating a wiring board provided with a passive element as set forth in claim 1 , further comprising:
forming a substantially conical conductive bump on a first surface of a third metal foil having the first surface and a second surface;
forming a substantially conical second conductive bump on the second surface of the second metal foil of the formed double-sided wiring board;
arranging a second insulating board having thermo-plasticity and thermosetting properties so as to face the first surface of the third metal foil, arranging the first metal foil side of the double-sided wiring board so as to face a surface different from a surface to which the third metal foil faces of the second insulating board, arranging a third insulating board having thermo-plasticity and thermosetting properties so as to face a side on which the second conductive bump is formed of the double-sided wiring board, and arranging a fourth metal foil so as to face a surface different from a surface that faces the double-sided wiring board of the third insulating board;
forming a four-layered wiring board by stacking, pressurizing and heating five, that is, the arranged third metal foil, second insulating board, double-sided wiring board, third insulating board, and fourth metal foil to integrate these so that the conductive bump formed on the third metal foil penetrates through the second insulating board and establishes an electrical contact with the first metal foil and the second conductive bump formed on the double-sided wiring board penetrates through the third insulating board and establishes an electrical contact with the fourth metal foil; and
patterning the third metal foil and/or the fourth metal foil of the formed four-layered wiring board.
14. A method for fabricating a wiring board provided with a passive element as set forth in claim 13 :
wherein the patterning the third metal foil and/or the fourth metal foil include formation an inductor that is vortically formed due to a pattern and/or a loop antenna that is formed loop-like due to a pattern.
15. A method for fabricating a wiring board provided with a passive element as set forth in claim 1 , further comprising:
coating a resistive paste and/or a dielectric paste on at least any one of first surfaces of a third and fourth metal foils each of which has the first surface and a second surface;
forming a substantially conical conductive bump on the first surface of the third metal foil;
forming a substantially conical second conductive bump on the second surface of the second metal foil of the formed double-sided wiring board;
arranging a second insulating board having thermo-plasticity and thermosetting properties so as to face the first surface of the third metal foil, arranging the first metal foil side of the double-sided wiring board so as to face a surface different from a surface to which the third metal foil faces of the second insulating board, arranging a third insulating board having thermo-plasticity and thermosetting properties so as to face a side on which the second conductive bump is formed of the double-sided wiring board, and arranging the first surface side of the fourth metal foil so as to face a surface different from a surface that faces the double-sided wiring board of the third insulating board;
forming a four-layered wiring board by stacking, pressurizing and heating five, that is, the arranged third metal foil, second insulating board, double-sided wiring board, third insulating board, and fourth metal foil to integrate these so that the conductive bump formed on the third metal foil penetrates through the second insulating board and establishes an electrical contact with the first metal foil and the second conductive bump formed on the double-sided wiring board penetrates through the third insulating board and establishes an electrical contact with the fourth metal foil; and
patterning the third metal foil and/or the fourth metal foil of the formed four layered wiring board.
16. A method for fabricating a wiring board provided with a passive element as set forth in claim 15 :
wherein the patterning the third metal foil and/or the fourth metal foil includes formation of an inductor that is vortically formed due to a pattern and/or a loop antenna that is formed loop-like due to a pattern.
17. A method for fabricating a wiring board provided with a passive element as set forth in claim 15 :
wherein the coating a resistive paste and/or a dielectric paste on at least any one of the first surfaces of the third and fourth metal foils includes removing a periphery portion thereof after the coating.
18. A method for fabricating a wiring board provided with a passive element as set forth in claim 2 , further comprising:
forming a through-hole in the formed double-sided wiring board; and
filling a magnetically permeable material in the formed through-hole.
19. A method for fabricating a wiring board provided with a passive element as set forth in claim 1 further comprising forming a substantially conical conductive bump on the first surface of the first metal foil, wherein the forming a double-sided wiring board is performed so that the formed conductive bump penetrates through the insulating board and establishes an electrical contact with the second metal foil, the method further comprising:
forming a substantially conical second conductive bump on a first surface of a third metal foil having the first surface and a second surface;
forming a substantially conical third conductive bump on the second surface of the second metal foil of the formed double-sided wiring board;
arranging a second insulating board having thermo-plasticity and thermosetting properties so as to face the first surface of the third metal foil, arranging the first metal foil side of the double-sided wiring board so as to face a surface different from a surface to which the third metal foil faces of the second insulating board, arranging a third insulating board having thermo-plasticity and thermosetting properties so as to face a side on which the third conductive bump is formed of the double-sided wiring board, and arranging the fourth metal foil so as to face a surface different from a surface that faces the double-sided wiring board of the third insulating board;
forming a four-layered wiring board by stacking, pressurizing and heating five, that is, the arranged third metal foil, second insulating board, double-sided wiring board, third insulating board, and fourth metal foil to integrate these so that the second conductive bump formed on the third metal foil penetrates through the second insulating board and establishes an electrical contact with the first metal foil, and the third conductive bump formed on the double-sided wiring board penetrates through the third insulating board and establishes an electrical contact with the fourth metal foil;
patterning the third metal foil and the fourth metal foil of the formed four-layered wiring board;
forming a through-hole in the formed four-layered wiring board; and
filling a magnetically permeable material in the formed through-hole.
20. A method for fabricating a wiring board provided with a passive element as set forth in claim 1 , further comprising:
coating a resistive paste and/or a dielectric paste on a first surface of a third metal foil having the first surface and a second surface;
forming a substantially conical conductive bump on the first surface of the third metal foil;
arranging a second insulating board having thermo-plasticity and thermosetting properties so as to face the first surface of the third metal foil, and arranging a first metal foil side of the double-sided wiring board so as to face a surface different from a surface that faces the third metal foil of the second insulating board;
forming a three-layered wiring board by stacking, pressurizing and heating three, that is, the arranged third metal foil, second insulating board, and double-sided wiring board to integrate these so that the conductive bump formed on the third metal foil penetrates through the second insulating board and establishes an electrical contact with the first metal foil; and
patterning the third metal foil of the formed three-layered wiring board.
21. A method for fabricating a wiring board provided with a passive element as set forth in claim 20 :
wherein the patterning the third metal foil includes formation of an inductor that is vortically formed due to a pattern and/or a loop antenna that is formed loop-like due to a pattern.
22. A method for fabricating a wiring board provided with a passive element as set forth in claim 20 :
wherein the coating a resistive paste and/or a dielectric paste on the first surface of the third metal foil includes removing a periphery portion thereof after the coating.
23. A method for fabricating a wiring board provided with a passive element, comprising:
coating a resistive paste on a first surface of at least a first metal foil of the first metal foil and a second metal foil each of which has a first surface and a second surface;
forming a substantially conical conductive bump on a resistive element formed of the coated resistive paste;
arranging an insulating board having thermo-plasticity and thermosetting properties so as to face the first surface of the first metal foil, and arranging the first surface of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board;
forming a double-sided wiring board by stacking, pressurizing and heating three, that is, the arranged first metal foil, insulating board, and second metal foil to integrate these so that the formed conductive bump penetrates through the insulating board and establishes an electrical contact and/or a heat conductive contact with the second metal foil; and
patterning the first metal foil and the second metal foil of the formed double-sided wiring board.
24. A method for fabricating a wiring board provided with a passive element, comprising:
coating a dielectric paste on a first surface of at least a second metal foil of a first metal foil and the second metal foil each of which has a first surface and a second surface;
coating a conductive paste so as to include on the coated dielectric paste and extend onto the first surface on which the dielectric paste is coated;
arranging an insulating board having thermo-plasticity and thermosetting properties so as to face the first surface of the first metal foil, and arranging the first surface of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board;
forming a double-sided wiring board by stacking, pressurizing and heating three, that is, the arranged first metal foil, insulating board, and second metal foil to integrate these; and
patterning at least the second metal foil of the formed double-sided wiring board.
25. A method for fabricating a wiring board provided with a passive element, comprising:
coating a dielectric paste on a first surface of at least a second metal foil of a first metal foil and the second metal foil each of which has a first surface and a second surface;
coating a first conductive paste so as to include on the coated dielectric paste and extend onto the first surface on which the dielectric paste is coated;
coating a second dielectric paste so as to include on the coated first conductive paste;
coating a second conductive paste so as to include on the coated second dielectric paste, to extend onto the first surface on which the second dielectric paste is coated, and not to come into contact with the first conductive paste;
arranging an insulating board having thermo-plasticity and thermosetting properties so as to face the first surface of the first metal foil, and arranging the first surface of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board;
forming a double-sided wiring board by stacking, pressurizing and heating three, that is, the arranged first metal foil, insulating board, and second metal foil to integrate these; and
patterning at least the second metal foil of the formed double-sided wiring board.
26. A method for fabricating a wiring board provided with a passive element, comprising:
forming a substantially conical conductive bump on a first surface of a first metal foil having the first surface and a second surface;
forming a substantially conical magnetically permeable bump on a first surface of a second metal foil having the first surface and a second surface;
arranging an insulating board having thermo-plasticity and thermosetting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board;
forming a double-sided wiring board by stacking, pressurizing and heating three, that is, the arranged first metal foil, insulating board, and second metal foil to integrate these so that the formed conductive bump and magnetically permeable bump penetrate through the insulating board and establish a contact with the first/second metal foil; and
patterning the first metal foil and the second metal foil of the formed double-sided wiring board.
27. A method for fabricating a wiring board provided with a passive element as set forth in claim 26 , further comprising:
forming a substantially conical second conductive bump on a first surface of a third metal foil having the first surface and a second surface;
forming a substantially conical second magnetically permeable bump on a first surface of a fourth metal foil having the first surface and a second surface;
forming a substantially conical third conductive bump on the second surface of the second metal foil of the formed double-sided wiring board;
forming a substantially conical third magnetically permeable bump on a surface on the first metal foil side of the formed double-sided wiring board;
arranging a second insulating board having thermo-plasticity and thermosetting properties so as to face the first surface of the third metal foil, arranging a first metal foil side of the double-sided wiring board so as to face a surface different from a surface to which the third metal foil faces of the second insulating board, arranging a third insulating board having thermo-plasticity and thermosetting properties so as to face a side on which the third conductive bump is formed of the double-sided wiring board, and arranging the first surface side of the fourth metal foil so as to face a surface different from a surface that faces the double-sided wiring board of the third insulating board;
forming a four-layered wiring board by stacking, pressurizing and heating five, that is, the arranged third metal foil, second insulating board, double-sided wiring board, third insulating board, and fourth metal foil to integrate these so that the second conductive bump formed on the third metal foil penetrates through the second insulating board and establishes an electrical contact with the first metal foil, the second magnetically permeable bump formed on the double-sided wiring board penetrates through the second insulating board and establishes a contact with the third metal foil, the third conductive bump formed on the double-sided wiring board penetrates through the third insulating board and establishes an electrical contact with the fourth metal foil, and the third magnetically permeable bump formed on the fourth metal foil penetrates through the third insulating board and establishes a contact with a surface on a side of the second metal foil of the double-sided wiring board; and
patterning the third metal foil and the fourth metal foil of the formed four-layered wiring board.