Patent Assignment
Reel/Frame 022039/0268
Assignment of Assignor's Interest
Recorded: 2008-12-30
Pages: 3
Assignors
KOBAYASHI, TAKAYUKI
Executed: 2008-12-19
SASAKI, TSUTOMU
Executed: 2008-12-19
TANAKA, MASAMOTO
Executed: 2008-12-19
KIMURA, KATSUICHI
Executed: 2008-12-19
Assignees
NIPPON STEEL MATERIALS CO., LTD.
4-14-1, SOTOKANDA, CHIYODA-KU, TOKYO, JAPAN
NIPPON MICROMETAL CORPORATION
158-1, SAYAMAGAHARA, IRUMA-SHI, 358-0032, JAPAN
Covered Property
(1)
Solder Alloy, Solder Ball and Electronic Member Having Solder Bump
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.