IP Library › Assignment 029434/0177
Patent Assignment
Reel/Frame 029434/0177

Change of Name

Recorded: 2012-12-10 Pages: 12
Assignor
NIPPON STEEL MATERIALS CO., LTD.
Executed: 2012-10-15
Assignee
NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties (20)
Copper Alloy Bonding Wire for Semiconductor Device
Patent: 8,610,291 →
Application: 11/848,403 →
Publication: US 2008/0061440
Semiconductor Mounting Bonding Wire
Patent: 8,097,960 →
Application: 12/146,792 →
Publication: US 2009/0072399
Lead-Free Solder Alloy, Solder Ball and Electronic Member, and Lead-Free Solder Alloy, Solder Ball and Electronic Member for Automobile-Mounted Electronic Member
Patent: 8,562,906 →
Application: 12/281,430 →
Publication: US 2009/0304545
Gold Wire for Semiconductor Element Connection
Patent: 8,415,797 →
Application: 12/294,416 →
Publication: US 2009/0115059
Solder Alloy, Solder Ball and Electronic Member Having Solder Bump
Patent: 8,501,088 →
Application: 12/345,942 →
Publication: US 2009/0196789
Wire Bonding Structure and Method for Forming Same
Patent: 8,247,911 →
Application: 12/445,789 →
Publication: US 2010/0213619
Bonding Wire for Semiconductor Devices
Patent: 8,389,860 →
Application: 12/669,612 →
Publication: US 2011/0011619
Bonding Wire for Semiconductor Devices
Patent: 8,299,356 →
Application: 12/669,662 →
Publication: US 2010/0294532
Semiconductor Device Bonding Wire and Wire Bonding Method
Patent: 8,102,061 →
Application: 12/670,253 →
Publication: US 2010/0327450
Bonding Wire for Semiconductor Device
Patent: 7,952,028 →
Application: 12/747,434 →
Publication: US 2010/0282495
Bonding Structure of Bonding Wire
Patent: 9,331,049 →
Application: 12/866,797 →
Publication: US 2011/0104510
Copper Alloy Bonding Wire for Semiconductor Device
Patent: 8,004,094 →
Application: 12/892,122 →
Publication: US 2011/0011618
Bonding Wire for Semiconductor
Patent: 8,815,019 →
Application: 12/993,401 →
Publication: US 2011/0120594
Saw Wire and Method of Manufacturing Saw Wire
Application: 13/140,770 →
Publication: US 2011/0308371
Lead-Free Solder Alloy, Solder Ball, and Electronic Member Comprising Solder Bump
Application: 13/264,625 →
Publication: US 2012/0038042
Bonding Wire for Semiconductor Device
Patent: 9,112,059 →
Application: 13/349,155 →
Publication: US 2012/0104613
Copper Alloy Bonding Wire for Semiconductor
Patent: 9,427,830 →
Application: 13/380,123 →
Publication: US 2012/0094121
Bonding Wire for Semiconductor
Patent: 8,742,258 →
Application: 13/384,819 →
Publication: US 2012/0118610
Solder Ball for Semiconductor Packaging and Electronic Member Using the Same
Patent: 9,024,442 →
Application: 13/508,864 →
Publication: US 2012/0223430
Copper Bonding Wire for Semiconductor Device and Bonding Structure Thereof
Patent: 8,653,668 →
Application: 13/577,199 →
Publication: US 2012/0299182
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 19, 2007
From: UNO, TOMOHIRO; KIMURA, KEIICHI; YAMADA, TAKASHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 019845/0422 →
Assignment of Assignor's Interest Jun 26, 2008
From: TERASHIMA, SHINICHI; UNO, TOMOHIRO; TATSUMI, KOHEI; YAMADA, TAKASHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 021155/0790 →
Assignment of Assignor's Interest Sep 2, 2008
From: TANAKA, MASAMOTO; SASAKI, TSUTOMU; KOBAYASHI, TAKAYUKI; KAWAKAMI, KAZUTO
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 021470/0775 →
Assignment of Assignor's Interest Sep 25, 2008
From: KIMURA, KEIICHI; UNO, TOMOHIRO; YAMADA, TAKASHI; NISHIBAYASHI, KAGEHITO
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 021583/0366 →
Change of Assignee's Address Dec 23, 2008
From: NIPPON STEEL MATERIALS CO., LTD.
To: NIPPON STEEL MATERIALS CO., LTD.
Reel/Frame 022020/0346 →
Assignment of Assignor's Interest Dec 30, 2008
From: KOBAYASHI, TAKAYUKI; SASAKI, TSUTOMU; TANAKA, MASAMOTO; KIMURA, KATSUICHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 022039/0268 →
Assignment of Assignor's Interest Jun 26, 2009
From: UNO, TOMOHIRO; TERASHIMA, SHINICHI; KIMURA, KEIICHI; YAMADA, TAKASHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 022880/0839 →
Assignment of Assignor's Interest Jan 26, 2010
From: UNO, TOMOHIRO; KIMURA, KEIICHI; TERASHIMA, SHINICHI; YAMADA, TAKASHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 023846/0502 →
Assignment of Assignor's Interest Jan 26, 2010
From: UNO, TOMOHIRO; KIMURA, KEIICHI; YAMADA, TAKASHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 023846/0672 →
Assignment of Assignor's Interest Jan 26, 2010
From: UNO, TOMOHIRO; KIMURA, KEIICHI; YAMADA, TAKASHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 023846/0753 →
Assignment of Assignor's Interest Jun 10, 2010
From: UNO, TOMOHIRO; KIMURA, KEIICHI; YAMADA, TAKASHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 024518/0303 →
Assignment of Assignor's Interest Oct 21, 2010
From: UNO, TOMOHIRO; YAMADA, TAKASHI; IKEDA, ATSUO
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 025175/0020 →
Assignment of Assignor's Interest Nov 18, 2010
From: UNO, TOMOHIRO; TERASHIMA, SHINICHI; YAMADA, TAKASHI; OISHI, RYO
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 025389/0679 →
Assignment of Assignor's Interest Sep 2, 2011
From: MORITA, MITSURU; SAKAMOTO, HIROAKI; TANAKA, MASAMOTO; TATSUMI, KOHEI
To: NIPPON STEEL MATERIALS CO., LTD.
Reel/Frame 026849/0961 →
Assignment of Assignor's Interest Oct 14, 2011
From: SASAKI, TSUTOMU; TERASHIMA, SHINICHI; TANAKA, MASAMOTO; KIMURA, KATSUICHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 027066/0227 →
Assignment of Assignor's Interest Dec 22, 2011
From: UNO, TOMOHIRO; TERASHIMA, SHINICHI; YAMADA, TAKASHI; ODA, DAIZO
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 027432/0533 →
Assignment of Assignor's Interest Jan 19, 2012
From: TERASHIMA, SHINICHI; UNO, TOMOHIRO; YAMADA, TAKASHI; ODA, DAIZO
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 027559/0066 →
Assignment of Assignor's Interest Jun 18, 2013
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
To: NIPPON STEEL & SUMITOMO METAL CORPORATION
Reel/Frame 030633/0422 →
Change of Name May 19, 2015
From: NIPPON STEEL MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 035727/0546 →
Change of Address Nov 4, 2015
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 037043/0474 →
Merger and Change of Name Mar 20, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 048646/0491 →
Merger and Change of Name May 15, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 049837/0872 →
Change of Name May 17, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 049219/0448 →
Change of Address Nov 22, 2019
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 051095/0147 →
Change of Address for Nippon Steel Chemical & Material Co., Ltd. Oct 21, 2020
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 054174/0502 →