Assignment of Assignor's Interest

Recorded: 2011-10-14 Pages: 4

Assignors

SASAKI, TSUTOMU

Executed: 2011-10-03

TERASHIMA, SHINICHI

Executed: 2011-10-03

TANAKA, MASAMOTO

Executed: 2011-10-03

KIMURA, KATSUICHI

Executed: 2011-10-03

Assignees

NIPPON STEEL MATERIALS CO., LTD.

14-1, SOTOKANDA 4-CHOME, CHIYODA-KU,, TOKYO, 1010021, JAPAN

NIPPON MICROMETAL CORPORATION

158-1, OAZA SAYAMAGAHARA, IRUMA-SHI,, SAITAMA, 3580032, JAPAN

Covered Property (1)

Lead-Free Solder Alloy, Solder Ball, and Electronic Member Comprising Solder Bump

Application: 13/264,625 →

Publication: US 2012/0038042

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.