IP Library › Assignment 035727/0546
Patent Assignment
Reel/Frame 035727/0546

Change of Name

Recorded: 2015-05-19 Pages: 12
Assignor
NIPPON STEEL MATERIALS CO., LTD.
Executed: 2014-11-13
Assignee
NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
16-3, GINZA 7-CHOME, CHUO-KU, TOKYO, 1040061, JAPAN
Covered Property (1)
Bonding Wire for Semiconductor Device
Patent: 9,112,059 →
Application: 13/349,155 →
Publication: US 2012/0104613
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Dec 10, 2012
From: NIPPON STEEL MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 029434/0177 →
Merger and Change of Name Mar 20, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 048646/0491 →
Change of Address Nov 22, 2019
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 051095/0147 →