IP Library › Assignment 048646/0491
Patent Assignment
Reel/Frame 048646/0491

Merger and Change of Name

Recorded: 2019-03-20 Pages: 28
Assignors
Assignee
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-0021, JAPAN
Covered Properties (15)
Copper Alloy Bonding Wire for Semiconductor Device
Patent: 8,610,291 →
Application: 11/848,403 →
Publication: US 2008/0061440
Semiconductor Mounting Bonding Wire
Patent: 8,097,960 →
Application: 12/146,792 →
Publication: US 2009/0072399
Lead-Free Solder Alloy, Solder Ball and Electronic Member, and Lead-Free Solder Alloy, Solder Ball and Electronic Member for Automobile-Mounted Electronic Member
Patent: 8,562,906 →
Application: 12/281,430 →
Publication: US 2009/0304545
Gold Wire for Semiconductor Element Connection
Patent: 8,415,797 →
Application: 12/294,416 →
Publication: US 2009/0115059
Wire Bonding Structure and Method for Forming Same
Patent: 8,247,911 →
Application: 12/445,789 →
Publication: US 2010/0213619
Bonding Wire for Semiconductor Devices
Patent: 8,389,860 →
Application: 12/669,612 →
Publication: US 2011/0011619
Bonding Wire for Semiconductor Devices
Patent: 8,299,356 →
Application: 12/669,662 →
Publication: US 2010/0294532
Semiconductor Device Bonding Wire and Wire Bonding Method
Patent: 8,102,061 →
Application: 12/670,253 →
Publication: US 2010/0327450
Bonding Wire for Semiconductor Device
Patent: 7,952,028 →
Application: 12/747,434 →
Publication: US 2010/0282495
Copper Alloy Bonding Wire for Semiconductor Device
Patent: 8,004,094 →
Application: 12/892,122 →
Publication: US 2011/0011618
Bonding Wire for Semiconductor
Patent: 8,815,019 →
Application: 12/993,401 →
Publication: US 2011/0120594
Bonding Wire for Semiconductor Device
Patent: 9,112,059 →
Application: 13/349,155 →
Publication: US 2012/0104613
Solder Ball for Semiconductor Packaging and Electronic Member Using the Same
Patent: 9,024,442 →
Application: 13/508,864 →
Publication: US 2012/0223430
Copper Bonding Wire for Semiconductor Device and Bonding Structure Thereof
Patent: 8,653,668 →
Application: 13/577,199 →
Publication: US 2012/0299182
Bonding Structure of Multilayer Copper Bonding Wire
Patent: 8,836,147 →
Application: 13/877,224 →
Publication: US 2013/0180757
Related Assignments (18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 19, 2007
From: UNO, TOMOHIRO; KIMURA, KEIICHI; YAMADA, TAKASHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 019845/0422 →
Assignment of Assignor's Interest Jun 26, 2008
From: TERASHIMA, SHINICHI; UNO, TOMOHIRO; TATSUMI, KOHEI; YAMADA, TAKASHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 021155/0790 →
Assignment of Assignor's Interest Sep 2, 2008
From: TANAKA, MASAMOTO; SASAKI, TSUTOMU; KOBAYASHI, TAKAYUKI; KAWAKAMI, KAZUTO
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 021470/0775 →
Assignment of Assignor's Interest Sep 25, 2008
From: KIMURA, KEIICHI; UNO, TOMOHIRO; YAMADA, TAKASHI; NISHIBAYASHI, KAGEHITO
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 021583/0366 →
Change of Assignee's Address Dec 23, 2008
From: NIPPON STEEL MATERIALS CO., LTD.
To: NIPPON STEEL MATERIALS CO., LTD.
Reel/Frame 022020/0346 →
Assignment of Assignor's Interest Jun 26, 2009
From: UNO, TOMOHIRO; TERASHIMA, SHINICHI; KIMURA, KEIICHI; YAMADA, TAKASHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 022880/0839 →
Assignment of Assignor's Interest Jan 26, 2010
From: UNO, TOMOHIRO; KIMURA, KEIICHI; YAMADA, TAKASHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 023846/0753 →
Assignment of Assignor's Interest Jan 26, 2010
From: UNO, TOMOHIRO; KIMURA, KEIICHI; TERASHIMA, SHINICHI; YAMADA, TAKASHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 023846/0502 →
Assignment of Assignor's Interest Jan 26, 2010
From: UNO, TOMOHIRO; KIMURA, KEIICHI; YAMADA, TAKASHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 023846/0672 →
Assignment of Assignor's Interest Jun 10, 2010
From: UNO, TOMOHIRO; KIMURA, KEIICHI; YAMADA, TAKASHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 024518/0303 →
Assignment of Assignor's Interest Nov 18, 2010
From: UNO, TOMOHIRO; TERASHIMA, SHINICHI; YAMADA, TAKASHI; OISHI, RYO
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 025389/0679 →
Assignment of Assignor's Interest May 9, 2012
From: TERASHIMA, SHINICHI; TANAKA, MASAMOTO; KIMURA, KATSUICHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 028181/0604 →
Assignment of Assignor's Interest Aug 3, 2012
From: UNO, TOMOHIRO; YAMADA, TAKASHI; IKEDA, ATSUO
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 028723/0616 →
Change of Name Dec 10, 2012
From: NIPPON STEEL MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 029434/0177 →
Assignment of Assignor's Interest Apr 1, 2013
From: UNO, TOMOHIRO; YAMADA, TAKASHI; IKEDA, ATSUO
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 030126/0952 →
Change of Address Mar 12, 2015
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 035186/0951 →
Change of Name May 19, 2015
From: NIPPON STEEL MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 035727/0546 →
Change of Address Nov 22, 2019
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 051095/0147 →