Patent Assignment
Reel/Frame 028181/0604
Assignment of Assignor's Interest
Recorded: 2012-05-09
Pages: 5
Assignors
TERASHIMA, SHINICHI
Executed: 2012-05-09
TANAKA, MASAMOTO
Executed: 2012-05-09
KIMURA, KATSUICHI
Executed: 2012-05-09
Assignees
NIPPON STEEL MATERIALS CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU,, TOKYO, 1010021, JAPAN
NIPPON MICROMETAL CORPORATION
158-1, OAZA SAYAMAGAHARA, IRUMA-SHI,, SAITAMA, 3580032, JAPAN
Covered Property
(1)
Solder Ball for Semiconductor Packaging and Electronic Member Using the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 10, 2012
From: NIPPON STEEL MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 029434/0177 →
Change of Address
Mar 12, 2015
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 035186/0951 →
Merger and Change of Name
Mar 20, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 048646/0491 →
Change of Address
Nov 22, 2019
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 051095/0147 →