IP Library › Assignment 035186/0951
Patent Assignment
Reel/Frame 035186/0951

Change of Address

Recorded: 2015-03-12 Pages: 12
Assignor
Assignee
NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
16-3, GINZA 7-CHOME, CHUO-KU, TOKYO, 1040061, JAPAN
Covered Property (1)
Solder Ball for Semiconductor Packaging and Electronic Member Using the Same
Patent: 9,024,442 →
Application: 13/508,864 →
Publication: US 2012/0223430
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 9, 2012
From: TERASHIMA, SHINICHI; TANAKA, MASAMOTO; KIMURA, KATSUICHI
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 028181/0604 →
Change of Name Dec 10, 2012
From: NIPPON STEEL MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 029434/0177 →
Merger and Change of Name Mar 20, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 048646/0491 →
Change of Address Nov 22, 2019
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 051095/0147 →