Wire bonding structure and method for forming same
View Patent ↗Provided is a bonding structure of a bonding wire and a method for forming the same which can solve problems of conventional technologies in practical application of a multilayer copper wire, improve the formability and bonding characteristic of a ball portion, improve the bonding strength of wedge connection, and have a superior industrial productivity. A bonding wire mainly composed of copper, and a concentrated layer where the concentration of a conductive metal other than copper is high is formed at a ball bonded portion. The concentrated layer is formed in the vicinity of the ball bonded portion or at the interface thereof. An area where the concentration of the conductive metal is 0.05 to 20 mol % has a thickness greater than or equal to 0.1 μm, and it is preferable that the concentration of the conductive metal in the concentrated layer should be five times as much as the average concentration of the conductive metal at the ball bonded portion other than the concentrated layer.
1. A bonding structure of a wire connected to an electrode of a semiconductor device through a ball bonded portion, comprising:
a bonding wire composed of copper as a main component and a conductive metal other than copper; and
a concentrated layer comprising the conductive metal formed at an interface between the ball bonded portion and the electrode,
wherein the concentrated layer has a high concentration of the conductive metal and has an area in which the concentration of the conductive metal is 0.05 to 20 mol %, said area having a thickness greater than or equal to 0.1 μm.
2. The bonding-wire bonding structure according to claim 1 , wherein the concentrated layer is formed at the surface of the ball bonded portion as well.
3. The bonding-wire bonding structure according to claim 2 , wherein the concentrated layer formed at the surface of the ball bonded portion has an area where the concentration of the conductive metal is 0.05 to 10 mol %, said area having a thickness greater than or equal to 0.1 μm.
4. The bonding-wire bonding structure according to claim 1 , wherein the concentration of the conductive metal in the concentrated layer is greater than or equal to five times as much as an average concentration of the conductive metal at the ball bonded portion other than the concentrated layer.
5. The bonding-wire bonding structure according to claim 1 , wherein the bonding wire comprises a core member mainly composed of copper and an outer coat layer mainly composed of the conductive metal and covering the core member.
6. The bonding-wire bonding structure according to claim 1 , wherein the conductive metal is palladium or platinum.
7. The bonding-wire bonding structure according to claim 1 , wherein an inside of the ball bonded portion lacks the formation of air bubble having a diameter greater than or equal to 10 μm.
8. The bonding-wire bonding structure according to claim 2 , wherein a surface of the ball bonded portion lacks an air-bubble trace having a diameter greater than or equal to 10 μm.
9. A method of forming a bonding-wire bonding structure according to claim 1 , comprising: a step of melting the leading end of the bonding wire by generating arc discharge between the bonding wire and a discharge torch to form the ball bonded portion.
10. The method according to claim 9 , further comprising the step of forming the ball bonded portion while maintaining an angle of a line, interconnecting the leading end of the bonding wire and the leading end of the discharge torch, relative to the lengthwise direction of the bonding wire within 60 degree.
11. The method according to claim 9 , further comprising the step of forming the ball bonded portion while spraying an inert gas or a reducing gas in the vicinity of the leading end of the bonding wire at a flow rate of 0.00005 to 0.005 m 3 /min.
12. The bonding-wire bonding structure according to claim 1 , wherein at least a part of the concentrated layer formed at the interface between the ball bonded portion and the electrode is formed inside at least either one of a diffusion layer and an intermetallic compound that are mainly composed of the primary element of the electrode and copper.
13. The bonding-wire bonding structure according to claim 12 , wherein at least a part of the concentrated layer is formed inside at least either one of the diffusion layer or the intermetallic compound, and an area where the concentration of the conductive metal is 0.5 to 30 mol % has a thickness greater than or equal to 0.01 μm.
14. The bonding-wire bonding structure according to claim 1 , wherein the concentrated layer is formed at the interface between the ball bonded portion and the electrode after the ball bonded portion is heated for 200 hours at 175° C., and an area where the concentration of the conductive metal is greater than or equal to 1 mol % has a thickness greater than or equal to 0.2 μm.
15. The bonding-wire bonding structure according to claim 2 , wherein the concentration of the conductive metal in the concentrated layer is greater than or equal to five times as much as an average concentration of the conductive metal at the ball bonded portion other than the concentrated layer.
16. The bonding-wire bonding structure according to claim 1 , wherein the bonding wire comprises a core member mainly composed of copper and an outer coat layer mainly composed of the conductive metal and covering the core member.
17. The bonding-wire bonding structure according to claim 2 , wherein the bonding wire comprises a core member mainly composed of copper and an outer coat layer mainly composed of the conductive metal and covering the core member.
18. The bonding-wire bonding structure according to claim 3 , wherein the bonding wire comprises a core member mainly composed of copper and an outer coat layer mainly composed of the conductive metal and covering the core member.
19. The bonding-wire bonding structure according to claim 2 , wherein the conductive metal is palladium or platinum.
20. The bonding-wire bonding structure according to claim 5 , wherein the conductive metal is palladium or platinum.
21. The bonding-wire bonding structure according to claim 16 , wherein the conductive metal is palladium or platinum.
22. The bonding-wire bonding structure according to claim 18 , wherein the conductive metal is palladium or platinum.
23. The bonding-wire bonding structure according to claim 16 , wherein the outer coat layer has a thickness of 0.002 to 0.8 μm.
24. The bonding-wire bonding structure according to claim 18 , wherein the outer coat layer has a thickness of 0.002 to 0.8 μm.
25. The bonding-wire bonding structure according to claim 16 , wherein a diffusion layer where copper and the conductive metal have a concentration gradient is formed between the core member and the outer coat layer.
26. The bonding-wire bonding structure according to claim 18 , wherein a diffusion layer where copper and the conductive metal have a concentration gradient is formed between the core member and the outer coat layer.