Patent Assignment
Reel/Frame 025389/0679
Assignment of Assignor's Interest
Recorded: 2010-11-18
Pages: 4
Assignors
UNO, TOMOHIRO
Executed: 2010-10-08
TERASHIMA, SHINICHI
Executed: 2010-10-08
YAMADA, TAKASHI
Executed: 2010-10-08
OISHI, RYO
Executed: 2010-10-08
ODA, DAIZO
Executed: 2010-10-08
Assignees
NIPPON STEEL MATERIALS CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU,, TOKYO, 1010021, JAPAN
NIPPON MICROMETAL CORPORATION
158-1, OAZA SAYAMAGAHARA, IRUMA-SHI,, SAITAMA, 3580032, JAPAN
Covered Property
(1)
Bonding Wire for Semiconductor
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 10, 2012
From: NIPPON STEEL MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 029434/0177 →
Merger and Change of Name
Mar 20, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 048646/0491 →
Change of Address
Nov 22, 2019
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 051095/0147 →