Semiconductor device bonding wire and wire bonding method
View Patent ↗It is an object of the present invention to provide a copper-based bonding wire whose material cost is low, having excellent ball bondability, reliability in a heat cycle test or reflow test, and storage life, enabling an application to thinning of a wire used for fine pitch connection. The bonding wire includes a core material having copper as a main component and an outer layer which is provided on the core material and contains a metal M and copper, in which the metal M differs from the core material in one or both of components and composition. The outer layer is 0.021 to 0.12 μm in thickness.
1. A semiconductor device bonding wire comprising:
a core material whose components include copper as a main component; and
an outer layer provided on said core material, said outer layer containing a metal M that differs from said core material in one or both of components and composition, and copper,
wherein said outer layer is 0.021 to 0.12 μm in thickness,
said metal M includes at least one element selected from among Au, Pd, Pt and Rh as a main component, and
said core material including copper as a main component contains at least one element selected from among P, B, Ir, Zr, Bi, and Ti, and an elemental concentration of said at least one element relative to the whole of the wire is in a range of from 0.0001 to 0.03 mol % in total.
2. The semiconductor device bonding wire according to claim 1 , wherein said outer layer contains at least one element selected from among Bi, P, Se and Tl, and an elemental concentration of said at least one element on the outermost surface of said outer layer is in a range of from 0.01 to 5 mol % in total.
3. The semiconductor device bonding wire according to claim 1 , wherein a diffusion layer is provided between said outer layer and said core material.
4. The semiconductor device bonding wire according to claim 1 , wherein a region where a concentration of said metal M relative to a total of metallic elements is 10 mol % or more is 0.03 to 0.2 μm in thickness.
5. The semiconductor device bonding wire according to claim 1 , wherein a region inside said outer layer where a total concentration of said metal M relative to a total of metallic elements is 90 mol % or more is 0.004 to 0.07 μm in thickness.
6. The semiconductor device bonding wire according to claim 1 , wherein a region inside said outer layer where a total concentration of said metal M relative to a total of metallic elements is 96 mol % or more is 0.002 to 0.06 μm in thickness.
7. The semiconductor device bonding wire according to claim 1 , wherein a copper concentration relative to a total of metallic elements in the outermost layer of the outer layer is 0.5 to 45 mol %.
8. The semiconductor device bonding wire according to claim 1 , wherein a region inside said outer layer where a copper concentration relative to a total of metallic elements is in a range of from 1 to 30 mol % is 0.0005 to 0.008 μm in thickness.
9. The semiconductor device bonding wire according to claim 1 , wherein a concentration of said metal M, which is contained in an entire wire and is other than copper, relative to a total of metallic elements is in a range of from 0.05 to 3 mol %.
10. The semiconductor device bonding wire according to claim 1 , wherein said outer layer is 0.021 to 0.095 μm in thickness.