Patent Assignment
Reel/Frame 023846/0502
Assignment of Assignor's Interest
Recorded: 2010-01-26
Pages: 4
Assignors
UNO, TOMOHIRO
Executed: 2010-01-18
KIMURA, KEIICHI
Executed: 2010-01-18
TERASHIMA, SHINICHI
Executed: 2010-01-18
YAMADA, TAKASHI
Executed: 2010-01-18
NISHIBAYASHI, AKIHITO
Executed: 2010-01-18
Assignees
NIPPON STEEL MATERIALS CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1010021, JAPAN
NIPPON MICROMETAL CORPORATION
158-1, OAZA SAYAMAGAHARA, IRUMA-SHI, SAITAMA, 3580032, JAPAN
Covered Property
(1)
Semiconductor Device Bonding Wire and Wire Bonding Method
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 10, 2012
From: NIPPON STEEL MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 029434/0177 →
Merger and Change of Name
Mar 20, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 048646/0491 →
Change of Address
Nov 22, 2019
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 051095/0147 →